Planar DCDC Power Board Layout for Lower Line Loss
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional communication and server power supply devices face issues with high line loss and limited power density due to complex electrical connections and size constraints of planar transformers, leading to increased line resistance and difficulty in enhancing power rating.
Innovation Solution
The power supply device integrates a DCDC conversion module directly on the power board, omitting intermediate interfaces by forming an output terminal on the power board, stacking bus capacitors on magnetic cover plates, and arranging transformers and secondary circuits sequentially, allowing for a planar arrangement that reduces interfaces and enlarges the magnetic core size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the planar-transformer PCB is vertically inserted on the power motherboard through multiple connection interfaces, then the electrical connection is established, but the line loss increases due to complex connection paths and high line resistance
Solution Approach 1:
The patent merges the planar transformer directly onto the power motherboard by integrating the transformer PCB with the power motherboard into a single coplanar structure. This eliminates multiple intermediate connection interfaces (capacitor PCB, gold fingers, additional metal conductors) and reduces the current path to a direct trace on the same PCB layer, thereby minimizing line resistance and energy loss while maintaining reliable electrical connection.
Solution Approach 2:
The patent extracts and eliminates the intermediate connection components (separate capacitor PCB, gold fingers, additional metal conductors) from the electrical connection path. By removing these unnecessary intermediate elements, the design achieves direct connection between the bus capacitor and planar transformer on the same power motherboard, reducing line loss without compromising connection reliability.
2Reliability
If the planar-transformer PCB is vertically inserted on the power motherboard, then the connection is established, but the transformer size is limited by the housing height, making it difficult to increase power rating
Solution Approach 1:
The patent transitions from a vertical three-dimensional insertion arrangement to a horizontal two-dimensional coplanar arrangement. By laying the planar transformer and power motherboard flat on the same plane rather than stacking them vertically, the design frees the transformer size from housing height constraints, allowing enlargement of the magnetic core and increase in power rating while maintaining reliable connection.
3Reliability
If multiple intermediate PCBs and connection interfaces are used to connect the bus capacitor to the planar transformer, then the electrical connection is established, but the device complexity increases
Solution Approach 1:
The patent merges the previously separate capacitor PCB and power motherboard into a single integrated power motherboard structure. The bus capacitor, planar transformer, and their interconnections are all integrated onto one coplanar board, eliminating multiple intermediate PCBs and connection interfaces, thereby reducing device complexity while ensuring reliable electrical connection.
4Ease of operation
If the PCB with gold fingers is not coplanar to the power mainboard to match terminal height, then the external terminals are connected, but additional metal conductors are needed, increasing line resistance
Solution Approach 1:
The patent merges the output terminal PCB into the same coplanar power motherboard structure, eliminating the need for separate metal conductors to match terminal heights. All components (bus capacitor, planar transformer, output terminals) are arranged on the same coplanar surface with direct trace connections, reducing line resistance and energy loss while maintaining ease of terminal connection.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration decreases current flow paths, simplifies manufacturing, reduces line loss, and enhances power density by integrating components directly on the power board, improving the transformer's power rating and product competitiveness.
Implementation Method 1
the transformer includes a transformer winding, at least two first magnetic columns, a first magnetic cover plate and a second magnetic cover plate. At least part of the transformer winding is formed by laying copper in the power board
Implementation Method 2
the transformer includes a transformer winding, at least two first magnetic columns, a first magnetic cover plate and a second magnetic cover plate
Implementation Method 3
The primary circuit includes a bus capacitor
Data Source
AI summary
A power supply device is disclosed and includes a housing, a power board, an output terminal and a DCDC conversion module. The housing includes an accommodation space, and a first opening of a rear plate in communication with the accommodation space. The power board disposed in parallel to the lower plate is at least partially accommodated in the accommodation space, and a peripheral edge is disposed adjacent to the rear plate. The output terminal is disposed in parallel to the lower plate, and passes through the first opening of the rear plate. The DCDC conversion module is accommodated in the accommodation space and includes a primary circuit, a transformer and a secondary circuit. The transformer and the secondary circuit are arranged on the power board in sequence. The secondary circuit is arranged on part of the power board existing the peripheral edge and electrically connected to the output terminal.