Planar Inductor Manufacturing with Composite Magnetic Layers
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Solution Overview
Problem
Current manufacturing methods for planar inductors in component-embedded substrates and printed electronics do not effectively combine conductive and magnetic layers to achieve high inductance, limiting the performance of electronic components and circuits.
Innovation Solution
A manufacturing method involving the formation of a first magnetic layer, a discontinuous layer of a second magnetic layer or conductive layer, and a third magnetic layer in a groove portion formed by the thickness difference between the second and conductive layers, using compositions with magnetic particles like Ni, Fe, and Mo, to create a planar inductor with enhanced inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a planar inductor uses only coils without magnetic material (air-core inductor), then the manufacturing process is simple, but the inductance is low
Solution Approach 1:
The patent combines conductive material layers with magnetic material layers to form a composite planar inductor structure. The conductive layer forms the coil pattern while the magnetic layer enhances the inductance, creating a composite structure that achieves both manufacturability and high inductance performance
2Ease of manufacture
If the thickness of magnetic layer and conductive layer are made equal, then the manufacturing process is simplified, but voids and defects occur due to poor filling
Solution Approach 1:
The patent applies different thickness values to different layers: the magnetic layer is designed with a first thickness while the conductive layer has a second thickness that is less than the first thickness. This local differentiation in thickness ensures proper filling without voids while maintaining manufacturing feasibility
3Ease of manufacture
If conventional manufacturing methods are used for planar inductors, then production is straightforward, but inductance cannot be sufficiently improved
Solution Approach 1:
The patent employs composite material construction by integrating magnetic material layers with conductive coil layers. This composite approach enables sufficient inductance improvement while maintaining compatibility with conventional manufacturing processes for planar inductors
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of inductors with higher inductance, reducing variation in thickness and minimizing voids, thereby improving the performance and integration density of electronic components and circuits.
Implementation Method 1
forming a first magnetic layer; forming a discontinuous layer of one of a second magnetic layer and a conductive layer on the first magnetic layer, and forming the other in a discontinuous portion of the discontinuous layer, in which a thickness of the second magnetic layer is larger than a thickness of the conductive layer
Data Source
AI summary
Provided are a manufacturing method of an inductor, including forming a first magnetic layer and forming a discontinuous layer of one of a second magnetic layer and a conductive layer on the first magnetic layer, and forming the other in a discontinuous portion of the discontinuous layer, in which a thickness of the second magnetic layer is larger than a thickness of the conductive layer, and the manufacturing method further includes forming a third magnetic layer in a groove portion formed by a difference in thickness between the second magnetic layer and the conductive layer; and a manufacturing method of an electronic component including an inductor, the manufacturing method including producing an inductor by the manufacturing method.