Planarized Detection Substrate for Higher X-Ray Pixel Fill Factor
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Solution Overview
Problem
Traditional X-ray detection technologies suffer from poor film layer uniformity, leading to a step difference of 5000 Å or more, which results in a reduced filling rate of detection pixels due to the inability of photosensitive devices to cover the detection pixel circuit area effectively.
Innovation Solution
A detection substrate with a base substrate, detection pixel circuits, a first passivation layer, a planarization layer, and photosensitive devices where the photosensitive devices are electrically connected to the detection pixel circuits through vias, with a planarization layer surface ensuring uniform film layers and allowing the photosensitive devices to partially or completely overlap with the detection pixel circuits, increasing the filling rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional X-ray detection technology is used, then the structure is simple, but the film layer uniformity is poor and the filling rate is low
Solution Approach 1:
The detection substrate is divided into multiple functional layers including base substrate, detection pixel circuits, first passivation layer, and planarization layer. This segmentation allows each layer to be optimized independently, with the planarization layer specifically addressing film uniformity while maintaining overall structural functionality.
Solution Approach 2:
The patent introduces a planarization layer that extends the vertical dimension of the substrate structure. This additional layer provides a planar surface that improves film layer uniformity without interfering with the horizontal arrangement of detection pixel circuits, effectively solving the uniformity issue through dimensional expansion.
2Productivity
If photosensitive devices are made larger to cover detection pixel circuits, then the filling rate increases, but the step difference becomes more pronounced
Solution Approach 1:
The planarization layer serves as an intermediary between the detection pixel circuits and the photosensitive devices. It provides a uniform planar surface that allows photosensitive devices to be positioned accurately without being affected by the underlying circuit structures, enabling high filling rate while maintaining manufacturing precision.
Solution Approach 2:
The patent changes the surface topology parameter by introducing the planarization layer, which transforms the non-planar surface (with step differences) into a planar surface. This parameter change allows photosensitive devices to overlap with detection pixel circuits effectively, increasing filling rate while eliminating step difference issues.
3Productivity
If a planarization layer is added to improve film uniformity, then the filling rate increases, but the device complexity increases
Solution Approach 1:
The planarization layer performs multiple functions: it provides a planar surface for improved film uniformity, serves as an electrical isolation layer, and enables accurate positioning of photosensitive devices. This multi-functionality justifies the added structural complexity by delivering multiple benefits simultaneously, particularly the increased filling rate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves the uniformity of film layers and increases the filling rate of detection pixels by allowing the photosensitive devices to overlap with the detection pixel circuits, enhancing the detection efficiency and stability of X-ray detection.
Implementation Method 1
X-ray digital radio graphy (DR), which emerged in the late 1990s, employs an X-ray flat panel detector to directly convert X images into digital images
Data Source
AI summary
A detection substrate and a ray detector are disclosed. The detection substrate includes a base substrate; a plurality of detection pixel circuits, located on the base substrate; a first passivation layer, located on the side, facing away from the base substrate, of the detection pixel circuits; a planarization layer, located on the side, facing away from the base substrate, of the first passivation layer, where the surface of the side, facing away from the first passivation layer, of the planarization layer is a plane; and a plurality of photosensitive devices; where the photosensitive devices are electrically connected to the detection pixel circuits in a one-to-one correspondence through vias penetrating through the first passivation layer and the planarization layer, and each photosensitive device includes a first portion and a second portion.