Plasma Generating Apparatus with Toroidal Ferrite Cores
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Solution Overview
Problem
Conventional plasma generating apparatuses face challenges in achieving high-density plasma uniformity and efficiency, particularly when using a single reaction chamber, leading to plasma loss and particle occurrence due to the requirement of a closed circuit path for secondary current signals.
Innovation Solution
A plasma generating apparatus utilizing a combination of high-frequency and low-frequency antenna systems, with toroidal-shaped ferrite cores and plasma channels, to induce a closed circuit current signal and maximize inductive coupling, thereby enhancing plasma generation efficiency and uniformity without the need for multiple reaction chambers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single reaction chamber is used to reduce device complexity, then device complexity is reduced, but plasma loss and particle occurrence increase due to inability to form closed circuit path for secondary current signals
Solution Approach 1:
The reaction chamber is segmented into multiple regions (first reaction chamber and second reaction chamber) within a single chamber structure, allowing different functional zones. This segmentation enables the formation of closed circuit paths for secondary current signals in specific regions while maintaining overall single-chamber simplicity, thus reducing plasma loss without significantly increasing device complexity.
Solution Approach 2:
A plasma channel is introduced as an intermediary component to guide and confine plasma flow between different regions of the reaction chamber. This plasma channel structure enables the formation of closed circuit paths for secondary current signals, allowing efficient plasma generation and reducing plasma loss while maintaining a single reaction chamber configuration.
2Productivity
If conventional ICP generating apparatus is used, then plasma generation efficiency is improved, but plasma uniformity deteriorates due to electromagnetic field affecting the sample
Solution Approach 1:
The reaction chamber is divided into distinct regions: a plasma generation region where high-power RF is applied for efficient plasma generation, and a processing region where samples are positioned away from strong electromagnetic fields to maintain plasma uniformity. This spatial segmentation allows simultaneous achievement of high plasma generation efficiency and uniform plasma distribution for precise manufacturing.
Solution Approach 2:
Different regions of the reaction chamber are optimized for different functions: the plasma generation region uses high-power RF coupling for efficient plasma production, while the processing region maintains controlled electromagnetic field conditions to ensure uniform plasma exposure on samples. This local optimization of quality parameters resolves the contradiction between efficiency and uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively generates high-density plasma with improved uniformity and efficiency, reducing plasma loss and increasing inductive coupling, making it compatible with large-area semiconductor fabrication and other plasma processing devices.
Implementation Method 1
a high-frequency antenna coil for providing a RF power having a high-frequency band so as to perform ignition of the plasma
Implementation Method 2
a low-frequency antenna coil for receiving the RF power having a low-frequency band so as to induce a current signal to the plasma
Implementation Method 3
maximize inductive coupling, thereby enhancing plasma generation efficiency
Implementation Method 4
a plasma channel for absorbing the RF power, and allowing a current signal to be induced to the plasma
Data Source
AI summary
A plasma generating apparatus having superior plasma generation efficiency that uses a single reaction chamber. The plasma generating apparatus includes a RF generator for providing a RF power, an antenna for generating an electromagnetic field upon receiving the RF power, a reaction chamber for exciting/ionizing a reaction gas via the electromagnetic field, and generating a plasma, and a plasma channel for absorbing the RF power, and allowing a current signal to be induced to the plasma.