Plasma Processing Apparatus Insulating Layer Abnormal Discharge
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Solution Overview
Problem
Plasma processing apparatuses face issues with abnormal discharge during plasma generation in film forming containers when a workpiece is sandwiched between them, leading to inefficiencies and potential damage.
Innovation Solution
A plasma processing apparatus with a conductive vacuum chamber featuring recessed portions and insulating layers covering the peripheral edges to prevent abnormal discharge, along with a detachable insulating layer to manage foreign matter, ensures effective plasma processing without abnormal discharge.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plasma is generated in the film forming containers with the workpiece sandwiched between the containers, then plasma processing can be performed on the workpiece, but abnormal discharge may occur in the film forming containers
Solution Approach 1:
An insulating layer is introduced as an intermediary between the conductive workpiece and the conductive peripheral edge portion of the vacuum chamber. This insulating layer prevents direct electrical contact and eliminates the abnormal discharge pathway while allowing the plasma processing to proceed normally between the workpiece and vacuum chamber
Solution Approach 2:
The insulating layer is applied specifically to the peripheral edge portion of the vacuum chamber that faces the workpiece, rather than covering the entire chamber. This localized application provides insulation exactly where needed to prevent abnormal discharge, while maintaining the conductive properties of the vacuum chamber in other areas for proper plasma generation and grounding
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses abnormal discharge between the workpiece and the vacuum chamber's edges, enhancing plasma processing efficiency and allowing for easier maintenance by preventing foreign matter-induced issues.
Implementation Method 1
an insulating layer configured to cover a portion of the peripheral edge portion facing the workpiece... the occurrence of abnormal discharge between the workpiece and the peripheral edge portion can be suppressed
Implementation Method 2
a voltage application unit configured to apply a voltage between the workpiece and the vacuum chamber... while the workpiece is subjected to plasma processing by applying a voltage between the workpiece and the vacuum chamber
Data Source
AI summary
A plasma processing apparatus configured to perform plasma processing on a conductive workpiece having a flat plate shape includes: a conductive vacuum chamber having a recessed portion which is configured to cause a processing object portion of at least one side of the workpiece having a flat plate shape to be disposed in the recessed portion and a peripheral edge portion which is provided outside the recessed portion to be continuous with the recessed portion; a holding member configured to hold the workpiece to be separated and insulated from the peripheral edge portion; a voltage application unit configured to apply a voltage between the workpiece and the vacuum chamber; and an insulating layer configured to cover a portion of the peripheral edge portion facing the workpiece.