Plasma Cleaning of Bonding Tool Tips for Semiconductor Manufacturing
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Solution Overview
Problem
Conventional bonding apparatuses face difficulties in effectively cleaning foreign substances from the tip of bonding tools, particularly during the bonding process, leading to inefficiencies and defects in the bonding operation.
Innovation Solution
A bonding apparatus equipped with a plasma generating section and a cleaning case that allows for the insertion of the bonding tool, where plasma state gas is ejected to clean the tip, combined with a vibration mechanism and gas exhaustion system, enabling effective removal of foreign substances without stopping the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the capillary is removed from the bonding apparatus for cleaning with chemical solution, then foreign substances can be removed from the capillary tip, but the bonding process is interrupted and time is lost
Solution Approach 1:
The patent replaces the mechanical removal and chemical cleaning process with an in-situ plasma cleaning system. A plasma generating unit is integrated into the bonding apparatus, allowing plasma to be generated directly at the capillary tip location. The plasma state gas cleanses foreign substances through chemical reactions without requiring capillary removal or chemical solutions, thus maintaining continuous bonding operations while achieving effective cleaning.
Solution Approach 2:
The patent introduces plasma state gas as an intermediary substance to perform the cleaning function. The plasma, generated from introduced gas (such as oxygen or nitrogen), acts as a mediator that chemically reacts with and removes foreign substances on the capillary tip surface. This intermediary approach enables cleaning without direct contact with chemical solutions or mechanical abrasion, allowing in-situ cleaning during the bonding process.
2Reliability
If the capillary is exchanged for a new one when foreign substances attach, then bonding defects are prevented, but device complexity increases and time is lost
Solution Approach 1:
The patent implements a self-service cleaning system where the capillary cleanses itself through plasma treatment. The plasma generating unit is positioned to treat the capillary tip in-situ, allowing the capillary to be cleaned automatically during or between bonding operations without requiring removal, exchange, or external cleaning equipment. This self-service approach maintains bonding quality while simplifying the overall system.
Solution Approach 2:
The patent performs preliminary cleaning action by generating plasma before foreign substances accumulate to problematic levels. The system can clean the capillary tip periodically or continuously during the bonding process, preventing contamination buildup rather than addressing it after defects occur. This preliminary action maintains bonding quality without requiring capillary exchange or complex monitoring systems.
3Reliability
If conventional cleaning methods are used, then foreign substances are removed, but the bonding apparatus must be stopped and operational efficiency decreases
Solution Approach 1:
The patent enables continuous useful action by integrating the plasma cleaning function into the bonding apparatus operation. The plasma generating unit can operate simultaneously with or between bonding cycles, maintaining capillary tip cleanliness without interrupting the bonding workflow. Gas is continuously introduced and plasma is generated to cleanse foreign substances, ensuring uninterrupted productive operation while maintaining tip cleanliness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for the effective removal of foreign substances from the bonding tool tips during the bonding process, enhancing the efficiency and accuracy of the bonding operation while preventing contamination and maintaining continuous operation of the bonding machines.
Implementation Method 1
a plasma generating section, which has a plasma nozzle of a plasma torch directed to a tip of the bonding tool located at cleaning position to eject plasma state gas and clean the tip of the bonding tool
Implementation Method 2
a vibration mechanism and gas exhaustion system, enabling effective removal of foreign substances
Data Source
AI summary
A wire bonding apparatus for manufacturing, for instance, semiconductor devices, including a cleaning case in which a microplasma generating section comprised of a plasma torch, which has a plasma nozzle 38 at the end, and capacitive coupling electrodes composed of an outer electrode and an inner electrode is fixed to the bottom of the cleaning case. The plasma nozzle is provided such that its center line is in alignment with the longitudinal center line of the capillary. Microplasma is ejected from below the capillary to clean its tip within the cleaning case. A shutter is provided on the top of the cleaning case and the wasted gas produced as a result of cleaning is exhausted out of the cleaning case through an exhaustion port of the cleaning case.