Plasma Chamber Component Cleaning via Multi-Stage Chemical Segmentation
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Solution Overview
Problem
Semiconductor process chamber components are challenging to clean effectively, leading to high replacement costs and waste due to residual materials from wafer processing, which are difficult to remove and often require disassembly and individual cleaning.
Innovation Solution
A method involving a series of chemical solutions, including heated oxidizing, stripping, and etching solutions, such as potassium hydroxide and potassium permanganate, hydrofluoric acid, and nitric acid, applied in specific ratios and processes to remove deposits from components, allowing for reuse.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional cleaning methods are used on plasma processing chamber components, then the cleaning process is simple and quick, but the cleaning effectiveness is insufficient and components cannot be reused
Solution Approach 1:
The cleaning process is divided into multiple sequential stages: pre-rinse with deionized water, oxidation with potassium permanganate solution, stripping with hydrofluoric acid, and final rinse. Each stage targets specific types of deposits and uses progressively stronger chemicals, transforming a single ineffective cleaning step into a multi-stage systematic process that achieves complete removal of all deposit types.
Solution Approach 2:
The cleaning process utilizes parameter changes by progressively increasing the chemical reactivity and strength through each stage. The oxidation stage uses potassium permanganate to convert organic deposits into water-soluble forms, the stripping stage employs hydrofluoric acid to dissolve inorganic residues, and each subsequent stage uses stronger solutions to address remaining contaminants, systematically changing chemical parameters to match different deposit types.
2Productivity
If components are replaced instead of cleaned, then the chamber is quickly restored to operational status, but operational costs increase and waste is generated
Solution Approach 1:
Instead of discarding used components after a single use, the invention recovers them through comprehensive cleaning. The multi-stage cleaning process completely removes all types of deposits (organic, inorganic, metallic, and composite), restoring components to their original state and enabling multiple reuse cycles, thereby transforming a disposable approach into a sustainable recovery and reuse system.
Solution Approach 2:
The heavy contamination that would normally render components unusable is converted into a benefit through the cleaning process. The stubborn deposits that indicate intensive use are systematically removed through oxidation, stripping, and rinsing stages, transforming what appears to be component failure into an opportunity for complete restoration and extended service life.
3Reliability
If strong chemical solutions are used to remove all types of deposits, then cleaning effectiveness improves, but the risk of damaging sensitive components increases
Solution Approach 1:
The cleaning process segments the removal of different deposit types into separate stages, using appropriately matched chemicals for each stage. Organic deposits are oxidized first with potassium permanganate, followed by inorganic deposits removed with hydrofluoric acid in the stripping stage. This segmentation allows each chemical to be optimized for its target deposit type without exposing the component to unnecessarily strong chemicals that could cause damage.
Solution Approach 2:
Each stage of the cleaning process applies a specific chemical solution with properties locally optimized for removing particular types of deposits. The oxidation stage uses potassium permanganate specifically for organic materials, while the stripping stage uses hydrofluoric acid specifically for inorganic residues. This local optimization of chemical properties ensures effective removal of each deposit type while minimizing exposure to harsh conditions that could damage sensitive component surfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the effective cleaning and reuse of previously unreusable components, reducing operational costs and waste by efficiently removing residual materials, thereby extending the life of chamber components.
Implementation Method 1
applying a heated oxidizing solution to the deposited material to oxidize a first portion of the deposited material
Implementation Method 2
applying a heated oxidizing solution to the deposited material
Data Source
AI summary
A system and method of cleaning a plasma processing chamber component includes removing the component from the plasma processing chamber, the removed component including a material deposited on the surface of the component. A heated oxidizing solution is applied to the material deposited on the component to oxidize a first portion deposited material. A stripping solution is applied to the component to remove the oxidized first portion of the deposited material. An etching solution is applied to remove a second portion of the deposited material and the cleaned component can be rinsed and dried.