Selective Pre-coating Plasma Chamber Confinement Rings

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Solution Overview

Problem

In plasma processing chambers, continuous exposure to the plasma sheath leads to erosion and surface contamination, resulting in lower substrate yields and increased operational costs due to the need for frequent replacement of protective materials.

Innovation Solution

A method involving the selective pre-coating of plasma processing chamber surfaces using optimized materials like silicon, silicon carbide, and hydrocarbons, which are deposited in specific areas using confinement rings to isolate and protect the surfaces from plasma damage, extending the operational life of chamber components.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If plasma processing is performed continuously, then substrate manufacturing productivity is improved, but chamber surface erosion and contamination increase leading to lower substrate yields

Engineering Contradiction:
Improvesubstrate manufacturing productivityVSAvoidsubstrate yield
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The patent applies preliminary action by depositing protective coatings on chamber surfaces before plasma processing begins. The method pre-coats surfaces with materials such as fluorinated hydrocarbons, silicon-containing materials, or silicon nitride to create a protective barrier that prevents erosion and contamination during subsequent plasma processing, thereby maintaining substrate yield while enabling continuous production

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent employs disposable-like protective coatings that can be easily deposited and removed. These coatings serve as sacrificial layers that protect the permanent chamber surfaces from plasma damage. The coatings are intentionally designed to be replaceable through simple processes such as oxygen plasma cleaning, allowing rapid renewal without expensive chamber maintenance or downtime

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

2Productivity

If plasma processing is performed continuously, then substrate manufacturing productivity is improved, but chamber component replacement frequency increases leading to higher operational costs

Engineering Contradiction:
Improvesubstrate manufacturing productivityVSAvoidchamber component lifespan
Core Design Contradiction:
ProductivityVSDuration of action of stationary object

Solution Approach 1:

The patent extends chamber component lifespan by pre-depositing protective coatings that act as sacrificial barriers. These coatings are applied before plasma processing and can be easily removed when depleted, allowing the permanent chamber components to remain intact and functional for much longer periods, thereby reducing replacement frequency and operational costs while maintaining continuous productivity

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent introduces protective coatings as intermediary layers between the plasma environment and chamber surfaces. These intermediary coatings absorb the harmful effects of plasma exposure, including ion bombardment and chemical etching, thereby mediating the interaction and protecting the permanent chamber components from direct damage, which extends their operational life without interrupting production

Inventive Principle:
Principle #24Intermediary (Mediator)

3Strength

If protective materials are applied to chamber surfaces, then surface wear resistance is improved, but contaminants are introduced affecting substrate quality

Engineering Contradiction:
Improvesurface wear resistanceVSAvoidsurface particle contamination
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The patent changes the material parameters of protective coatings by selecting substances that are volatile under plasma conditions, such as fluorinated hydrocarbons and silicon-containing materials. These materials provide wear resistance during plasma processing but can be completely removed via oxygen plasma cleaning or heating, leaving no residual contamination on chamber surfaces that could affect substrate quality

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent exploits phase transitions of protective coating materials to resolve the contradiction. The coatings are deposited in a solid or liquid state to provide surface protection, then transformed into vapor phase through oxygen plasma treatment or heating to completely remove them without leaving particulate contamination. This phase change enables the coating to serve its protective function temporarily and then be cleanly eliminated

Inventive Principle:
Principle #36Phase transitions

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method reduces plasma surface damage and contamination, thereby enhancing substrate yield and reducing operational costs by extending the lifespan of chamber components.

Implementation Method 1

depositing a first coating on a first portion of the plasma processing system using a first plasma

Methodology Applied
Scientific EffectPhysical Vapour Deposition: Physical Vapour Deposition

Implementation Method 2

depositing a first coating on a first portion of the plasma processing system using a first plasma

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 3

the plasma sheath tends to accelerate charged particles (e.g., ions, etc.) from the plasma edge to strike surfaces in the plasma chamber

Methodology Applied
Scientific EffectIon acceleration by electric field: Electric Field

Data Source

PatentUS8298626B2Methods for selective pre-coating of a plasma processing chamber
Publication Date: 2012.10.30 LAM RES CORP
  • US8298626B2 patent drawing
  • US8298626B2 patent drawing
  • US8298626B2 patent drawing

AI summary

A method for processing a substrate in a plasma processing system is provided. The method includes disposing a first confinement ring set in a first position. The method also includes depositing a first coating on a first portion of the plasma processing system using a first plasma in a first area defined by the first confinement ring set in the first position. The method further includes depositing a second coating on a second portion of the plasma processing system using a second plasma in a second area between the first confinement ring set in the first position and a second confinement ring set. The method yet also includes processing the substrate using a third plasma with the first confinement ring set disposed in a second position.