Electric Discharge Tubes TRIZ Cases

Segmented wipers and elastic members wipe residual moisture from plug connectors, preventing electrolytic corrosion in medical device applications.

Segmented radio frequency power units synchronize pulse-modulated signals to control electron temperature and plasma density, suppressing charging damage.

Rotating connection post couples primary and secondary modules, resolving the trade-off between versatile functionality and cumbersome connection complexity.

Sulfurizing aluminum electrodes with sulfur-oxygen plasma removes metallic deposits and prevents AlFx formation during 3D NAND etching.

Segmented upper and lower shower heads jet purge and plasma gases to form a rear reinforcing film while preventing front surface contamination.

A charged particle beam writing method resizes shot figures to ensure sufficient irradiation at pattern edges.

Microchannel plate holes anchor carbon nanotubes against electric field forces, extending cathode lifespan while maintaining manufacturing ease.

A beam regulating portion arranges unit lens elements to adjust magnetic or electric fields for precise ion implantation.

Isotropic plasma etching at low pressure removes lateral film portions to prevent merging, maintaining strain effects and device reliability.

A sintered material comprising yttrium oxyfluoride enhances plasma resistance and corrosion protection in semiconductor manufacturing chambers.

Selective pre-coating plasma chamber surfaces using confinement rings to isolate deposition areas, reducing erosion and extending component lifespan.

A scanning electron microscope uses a pressure-resistant membrane to scan objects outside vacuum, determining working distance without contaminating optics.

Multiple detector configurations capture emitted radiation to generate composite reference images for charged-particle microscopy.

An impedance adjusting circuit maintains a predetermined floating potential of the substrate during sputtering deposition.

A radiation source assembly integrates a locking mechanism that secures the elongate lamp within the reactor port until electrical power disconnects.

A movable grounding component switches an upper electrode between RF and ground states to minimize arcing during mode transitions.

Extending the shared vacuum port into a front-wall housing increases utility line routing space, resolving stem size constraints in tandem processing regions.

Dynamic electrode spacing optimizes curing efficiency and etching uniformity, resolving the trade-off between transcription accuracy and process time.

Sorting portion selects electrons by emission angle while deflector directs them based on energy for detection.

Matched curved beam bender electrodes reduce trajectory misalignment and aberration for improved convergence in limited microscope spaces.

Segmented vacuum assembly eliminates bulky high-voltage motors and vibration, improving ion implantation accuracy.

Rounding diffuser plate corners via abrasion minimizes film stress and prevents material flaking during PECVD deposition.

A cathode device uses a parallel link mechanism to dynamically position a magnetic circuit, resolving uneven erosion caused by constant horizontal fields.

Low-resistivity LiCoO2 targets enable high-speed DC sputtering, resolving the trade-off between deposition speed and abnormal discharge stability.

Real-time free radical monitoring detects chamber wall deposition to reduce seasoning time and prevent production interruptions.

An electrical connector uses nested cavities to accommodate standard and high-speed plugs simultaneously.

A V/I sensor measures delivered and received RF power to calculate a dimensionless ratio for real-time plasma state detection.

Cyclic plasma modification and removal eliminate grain boundary etching and residues in poly-granular metal films.

Segmented insulative housing resists step portion deformation during molding to ensure reliable printed circuit board mounting.

Alternating angled ion and molecular beams deposit dopant oxides on vertical sidewalls, resolving incomplete doping in reentrant structures.

A substrate support with a porous resin intermediary suppresses abnormal discharge in heat transfer gas supply holes during high-pressure cooling.

Actuators tilt a stationary substrate support via precession motion, eliminating rotating journals and slip rings that fail during semiconductor etching.

A microcalorimeter x-ray spectrometer employs a wide-angle optic and multiple detectors to increase x-ray collection, enabling high-resolution mapping.

Acceleration-deceleration parallelizing lens system processes fanned ribbon ion beams into substantially parallel high-current streams.

Oxygen gas purges halogen-based chamber residues to restore the stainless steel passive film integrity.

Segmented assemblies and bidirectional transport improve ion uniformity across large substrates while reducing manufacturing costs.

Synthetic load impedance fixtures replicate plasma conditions to determine match network model parameters using benchtop measurements.

A plasma source system generates hydrogen molecular ions and helium ions for substrate processing.

Extraction and detection modules analyze light emission intensities across multiple etching cycles to identify the precise endpoint.

Porous foam materials trap redeposited sputter within shield assemblies, reducing particle counts and extending maintenance intervals.

Independent piezoelectric actuators correct thermal height variations to maintain manufacturing precision without manual intervention.

Segmented inner and outer rings create a gap that extracts polymer accumulation, improving yield and reducing maintenance downtime.

A plasma sheath modifier shapes the boundary to direct ions at varied angles toward resist material.

Segmented recess configurations on the EM wave launcher control electromagnetic energy propagation, preventing mode jumps that degrade plasma stability.

An RF plasma ion source eliminates auxiliary electron sources to extend operational lifetime and improve corrosive environment reliability.

Segmented ground assembly with flexible straps reduces arcing and leakage in plasma chambers while lowering maintenance costs.