Precession Substrate Tilt for Ion Beam Incidence Control
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Solution Overview
Problem
In semiconductor manufacturing, the rotating journals and slip rings used to control the ion beam direction on substrates during etching processes have limited lifetimes due to rotating-seal and contactor failures, necessitating the elimination of these components while maintaining uniform etching.
Innovation Solution
A precession motion is imparted to the substrate support using actuators or rotating cams, allowing the ion beam to impinge on the substrate at varying angles without rotating the substrate, thus eliminating the need for expensive rotating components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If rotating journals and slip rings are used to control ion beam direction, then uniform etching is achieved, but equipment reliability deteriorates due to rotating-seal and contactor failures
Solution Approach 1:
The patent removes the rotating journal and slip ring components from the substrate support system. Instead of rotating the substrate to control ion beam incidence angles, the system uses a stationary substrate support with actuators that directly adjust the substrate tilt angle, eliminating the rotating seals and contactors that caused reliability issues while maintaining uniform etching control
Solution Approach 2:
The patent replaces the mechanical rotation system with an actuator-based tilt control system. Rather than using rotating journals and slip rings to physically rotate the substrate, the system uses electrically-controlled actuators to adjust the substrate support tilt angle, substituting a reliable electrical control mechanism for the failure-prone mechanical rotating components
2Manufacturing precision
If substrate rotation is used to control ion beam incidence, then etching uniformity is improved, but device complexity increases due to rotating components
Solution Approach 1:
The patent extracts and removes the rotating journal and slip ring components from the substrate support system. Instead of rotating the substrate to control ion beam incidence angles, the system uses a stationary substrate support with actuators that directly adjust the substrate tilt angle, eliminating the rotating seals and contactors that caused reliability issues while maintaining uniform etching control
Solution Approach 2:
The patent makes the substrate support stationary and multi-functional. Rather than requiring separate rotation mechanisms, the stationary support integrates tilt adjustment capabilities through actuators, allowing the same component to both hold the substrate and control its orientation relative to the ion beam, thereby reducing overall device complexity
3Productivity
If faster substrate rotation is used to improve etching speed, then productivity increases, but journal lifetime decreases due to rotating-seal failure
Solution Approach 1:
The patent removes the rotating journal and slip ring components from the substrate support system. Instead of rotating the substrate to control ion beam incidence angles, the system uses a stationary substrate support with actuators that directly adjust the substrate tilt angle, eliminating the rotating seals and contactors that caused reliability issues while maintaining uniform etching control
Solution Approach 2:
The patent replaces the mechanical rotation system with an actuator-based tilt control system. Rather than using rotating journals and slip rings to physically rotate the substrate, the system uses electrically-controlled actuators to adjust the substrate support tilt angle, substituting a reliable electrical control mechanism for the failure-prone mechanical rotating components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach extends the lifespan of manufacturing equipment by avoiding the failure-prone rotating components and ensures uniform etching by controlling the ion beam's angle of incidence, enhancing the efficiency and reliability of the etching process.
Implementation Method 1
The precession assembly is programmed to cause a precession motion to be imparted to the substrate support when the first actuator and the second actuator move up and down relative to the center support
Implementation Method 2
The ion source is configured to produce ions when the plasma is struck and the ions are directed toward the substrate support
Implementation Method 3
The precession motion causing a rotating tilt of the substrate support without rotation of the substrate support. The rotating tilt of the substrate is configured to cause the ions generated by the ion source to impinge upon a surface of the substrate in continually varying angles of incidence
Data Source
AI summary
One system includes a chamber, a chuck assembly, and an ion source. The chuck assembly includes a substrate support and a precession assembly with a center support coupled to a stationary center point of an under region of the substrate support. The precession assembly includes first and second actuators connected to first and second locations, respectively, that are in the under region off-set from the center point. The precession assembly imparts a precession motion to the substrate support when the first actuator and the second actuator move up and down relative to the center support, and the precession motion imparted to the substrate causes a rotating tilt of the substrate support without rotation of the substrate support. The rotating tilt of the substrate is configured to cause ions generated by the ion source to impinge upon a surface of the substrate in continually varying angles of incidence.