Plasma Processing Cover with Composite Thermal Conductivity
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Solution Overview
Problem
Conventional plasma processing apparatuses cause thermal damage to the holding sheet due to heat accumulation in the cover during plasma etching, as the cover made of materials like quartz and ceramics becomes hot and exposes the annular frame to thermal stress.
Innovation Solution
A plasma processing apparatus with a cover made of high thermal conductivity materials, such as metals or ceramics, and a protect part on the window side made of low reactivity materials like quartz or alumina, allowing for efficient heat dissipation and preventing thermal damage to the carrier.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the cover is made of materials with good etching resistance (quartz, ceramics), then the annular frame is protected from plasma exposure, but heat accumulates in the cover causing thermal damage to the holding sheet
Solution Approach 1:
The cover is constructed as a composite structure combining a metal base material (high thermal conductivity) with a plasma-resistant coating layer (low reactivity). This composite design allows the metal to conduct heat away while the coating provides plasma etching resistance, resolving the contradiction between heat dissipation and etching resistance
Solution Approach 2:
The invention changes the material parameter of the cover from low thermal conductivity (quartz, ceramics) to high thermal conductivity (metal with plasma-resistant coating). This parameter change enables effective heat dissipation while maintaining plasma protection through the specialized coating layer
2Temperature
If the cover is made of materials with high thermal conductivity, then heat can escape easily reducing thermal effect on the carrier, but the material may have poor etching resistance
Solution Approach 1:
The cover combines metal (high thermal conductivity) with plasma-resistant coating material, creating a composite structure where each layer performs its optimal function: the metal conducts heat away and the coating provides plasma etching resistance
Solution Approach 2:
Different parts of the cover have different material properties: the base material (metal) provides high thermal conductivity for heat dissipation, while the surface coating provides low reactivity with plasma. This local differentiation of material quality resolves the contradiction between thermal performance and plasma resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces thermal damage to the carrier by facilitating heat escape through the high thermal conductivity cover and enhances durability by preventing plasma reactivity issues, thereby increasing etching rates and throughput.
Implementation Method 1
the cover is made of a material having a high thermal conductivity, and a front face exposed to plasma, at least on the window side of the cover, is covered with a protect part made of a material having a low reactivity with plasma
Data Source
AI summary
In plasma processing, damage on a cover is prevented while thermal effect on an annular frame is suppressed. Plasma processing is applied to a substrate held by a carrier including an annular frame and a holding sheet. There are provided a chamber having a decompressible internal space, a plasma source for generating plasma in the chamber, a stage that is provided in the chamber and places the carrier thereon, and a cover that is placed above the stage to cover the holding sheet and the frame, and has a window penetrating through the thickness of the cover. The cover is made of a material having a high thermal conductivity, and a front face exposed to plasma, at least on the side of the window of the cover, is covered with a protect part made of a material having a low reactivity with plasma.