Plasma Deposition Apparatus for Large OLED Thin Films
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Solution Overview
Problem
The challenge lies in efficiently forming large thin films with desired characteristics for organic light emitting display apparatuses, as existing deposition methods struggle with high efficiency and quality, especially as the apparatuses grow in size and resolution.
Innovation Solution
A deposition apparatus is designed with a plasma generating member that converts raw material gas into a radical form and a plasma processor that enhances the deposition process, including a filament member for heat and thermion emission, and multiple plasma processors to improve film purity and characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If conventional deposition methods are used for large high-resolution display apparatuses, then the apparatus size and resolution can be increased, but the deposition efficiency and film quality deteriorate
Solution Approach 1:
The plasma processor is divided into multiple independent plasma generation units arranged in an array, allowing parallel deposition operations across different regions of the substrate. This segmentation enables simultaneous deposition of multiple thin films, maintaining high efficiency even as the display apparatus size increases.
Solution Approach 2:
The invention transitions from conventional single-point or linear deposition to a two-dimensional array of plasma generation units. This dimensional expansion allows coverage of large substrate areas while maintaining high deposition rates through parallel operations across the array.
2Area of moving object
If conventional deposition methods are used for large high-resolution display apparatuses, then the apparatus size and resolution can be increased, but the film characteristics and purity worsen
Solution Approach 1:
Each plasma generation unit in the array operates independently with controlled plasma parameters, allowing precise control of film characteristics across different substrate regions. This segmentation enables maintenance of high manufacturing precision even for large-area displays with varying local requirements.
Solution Approach 2:
The invention employs plasma processing with controlled plasma parameters (power, gas flow, pressure) to enhance film purity and characteristics. The plasma environment enables better control of deposition conditions compared to conventional methods, improving film quality for large-resolution displays.
3Productivity
If plasma generation is enhanced to improve deposition efficiency, then the converting efficiency of raw material gas to radical form increases, but the device complexity increases
Solution Approach 1:
Each plasma generation unit in the array is designed as a modular, universal component that can be replicated and arranged in different configurations. This modularity reduces overall system complexity by using standardized units rather than custom-designed complex systems, while still achieving high deposition efficiency through parallel operation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently forms high-quality thin films by increasing the converting efficiency of raw material gases to radical forms, improving film purity and characteristics, and effectively addressing the limitations of existing methods for large organic light emitting display apparatuses.
Implementation Method 1
a plasma generating member which receives a raw material gas and converts the raw material gas to a deposition source material in a radical form
Implementation Method 2
a filament member disposed inside the plasma generating member
Data Source
AI summary
A deposition apparatus for performing a deposition process on a substrate includes: an injection unit including a plasma generating member which receives a raw material gas and converts the raw material gas to a deposition source material in a radical form; and a plasma processor disposed adjacent to the injection unit and facing a side of the injection unit, wherein the plasma processor performs a plasma process in a direction facing the substrate.