Atmospheric Plasma Electrode Stepped Gap Uniformity
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Solution Overview
Problem
Existing Atmospheric-Pressure Plasma processing apparatuses face challenges in achieving even plasma distribution on glass substrates, leading to uneven photoresist adhesion and reduced product yield due to the formation of extensive quick impulsive discharge channels and plasma leakage through holes in the lower electrode plate.
Innovation Solution
The apparatus features two electrode plates with a stepped surface configuration, generating radio-frequency capacitive coupling plasma within a gap with a narrower upper and wider lower portion, ensuring uniform plasma distribution and eliminating the need for insulation dielectrics, thus improving plasma uniformity and adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If insulation dielectrics are arranged between electrode plates to prevent DC breakdown discharge, then arc light and spark discharge are avoided, but extensive quick impulsive discharge channels are formed making even plasma distribution difficult
Solution Approach 1:
The patent removes the insulation dielectric layer from between the electrode plates, extracting the harmful element that caused uneven plasma distribution. By eliminating the dielectric barrier, the system achieves more uniform plasma generation across the substrate surface while maintaining reliable operation through controlled RF discharge mechanisms.
Solution Approach 2:
The patent replaces the mechanical/dielectric insulation approach with an electromagnetic field-based solution using RF generators and controlled electric fields. This substitution allows for more precise control of plasma formation and distribution without the physical constraints of dielectric materials.
2Productivity
If through holes are provided in the lower electrode plate for plasma passage, then plasma can process the glass substrate, but plasma density becomes uneven with higher density at hole positions and lower density between holes
Solution Approach 1:
The patent removes the through-hole structure from the lower electrode plate, extracting the source of non-uniform plasma distribution. By eliminating the holes, plasma can be generated uniformly across the entire electrode surface and distributed evenly onto the substrate without the concentration effects caused by localized hole openings.
Solution Approach 2:
The patent implements a uniform plasma generation approach where the electrode plate surface maintains consistent properties across all areas. Instead of localized plasma generation through holes, the entire electrode surface contributes equally to plasma formation, ensuring uniform plasma density and processing quality across the substrate.
3Power
If AC voltage is applied to electrode plates to generate Dielectric Barrier Discharge, then plasma is provided for surface treatment, but the discharge manner creates extensive quick impulsive discharge channels
Solution Approach 1:
The patent changes the discharge parameters from DBD mode to RF capacitive coupling mode. By adjusting the frequency, voltage, and electrode configuration parameters, the system transitions from impulsive discharge channels to continuous, uniform plasma generation. This parameter optimization enables both sufficient power for plasma generation and even distribution across the substrate.
Solution Approach 2:
The patent inverts the traditional DBD approach by eliminating the dielectric barrier and using direct RF capacitive coupling between electrodes. This inverted approach generates plasma through the gap without the impulsive discharge channels characteristic of DBD, achieving uniform plasma distribution while maintaining effective processing power.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration achieves even plasma distribution on the substrate, preventing photoresist peeling and enhancing product yield while reducing manufacturing costs and facilitating maintenance.
Implementation Method 1
the radio-frequency generator is connected to the two electrode plates, and applies radio-frequency signals to the two electrode plates so as to generate plasma within the gap
Implementation Method 2
one of which is a flat surface, and the other is a stepped surface, such that a gap is provided between the two electrode plates and said gap comprising a narrower gap part at an upper side and a wider gap part at a lower side
Data Source
AI summary
An Atmospheric-Pressure Plasma processing apparatus used for Atmospheric-Pressure Plasma processing of substrates, comprises a radio-frequency generator and two electrode plates disposed vertically and opposing each other. The two electrode plates have two surface opposing to each other, one of which is a flat surface, and the other is a stepped surface, such that a gap is provided between the two electrode plates and said gap comprising a narrower gap part at an upper side and a wider gap part at a lower side. The radio-frequency generator is connected to the two electrode plates, and applies radio-frequency signals to the two electrode plates so as to generate plasma within the gap.