Plasma Filter Assembly for Dynamic Flow Control

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Solution Overview

Problem

Conventional sieve filters in plasma etching systems lack flexibility in controlling plasma flow distribution, requiring a trial-and-error approach and necessitating filter replacement for changes in plasma flow configuration, limiting the precision and efficiency of the etching process.

Innovation Solution

A plasma filter assembly with displaceable stencil filters and actuators that allow for real-time adjustment of plasma flow passages, enabling precise control of plasma flow size, shape, and concentration by varying the relative positions and sizes of the filters, and using electrodes to control the speed of plasma particles.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional sieve filters with fixed opening configurations are used, then the etching process can be performed with simple filter manufacturing, but the flexibility and precision of plasma flow control is limited requiring trial-and-error approach and filter replacement

Engineering Contradiction:

Improveflexibility of plasma flow controlVSAvoidcomplexity of filter assembly

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The filter assembly is divided into multiple discrete stencil filters, each with different opening configurations. These individual stencil filters can be selectively positioned and combined to create various plasma flow patterns, replacing the need for a single complex fixed filter design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The stencil filters are made displaceable relative to one another, allowing dynamic adjustment of plasma flow passages during operation. This enables real-time modification of plasma distribution patterns without replacing entire filter assemblies, providing adaptability while maintaining manageable complexity.

Inventive Principle:

Principle #15Dynamics

2Manufacturing precision

If stencil filters are made displaceable with actuators for real-time adjustment, then precise control of plasma flow characteristics is achieved, but the device complexity increases

Engineering Contradiction:

Improveprecision of plasma flow controlVSAvoidcomplexity of filter assembly

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

Actuators are incorporated to enable precise, controlled displacement of stencil filters relative to one another. This dynamic positioning system allows for accurate adjustment of plasma flow passage geometries, achieving high precision in plasma flow control while maintaining a modular architecture that manages overall device complexity.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system controls plasma flow characteristics by changing the relative positions of stencil filters through actuator mechanisms. This parameter adjustment approach enables precise control over plasma flow size, shape, and distribution by modifying the geometric parameters of flow passages without requiring complete redesign of the filter assembly.

Inventive Principle:

Principle #35Parameter changes

3Adaptability or versatility

If multiple stencil filters with different opening configurations are used, then adaptability for different plasma flow patterns is improved, but the quantity of filters and device complexity increases

Engineering Contradiction:

Improveadaptability for different plasma flow patternsVSAvoidquantity of stencil filters

Core Design Contradiction:

Adaptability or versatilityVSQuantity of substance

Solution Approach 1:

Rather than using one complex filter, the system segments the filtering function into multiple simpler stencil filters with different opening configurations. These segmented filters work together in combination, reducing the total quantity needed while improving adaptability for different plasma flow patterns.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Each stencil filter is designed with universal applicability, where the same filter can be positioned in different locations and combined with other filters to serve multiple plasma flow control functions. This multi-functionality reduces the overall quantity of filters required while maintaining high adaptability.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enhances the flexibility and precision of plasma etching by allowing on-the-fly adjustments of plasma flow characteristics, improving etching profiles and reducing the need for filter replacements, thereby optimizing the etching process.

Implementation Method 1

using electrodes to control the speed of plasma particles

Methodology Applied

Scientific EffectElectric field: Electric Field

Implementation Method 2

Plasma etching is often a preferred etching technique... a plasma (defined as a partially ionized gas composed of ions, electrons, and neutral species) is transported to and reacts with a surface of a wafer or other target

Methodology Applied

Scientific EffectPlasma: Plasma

Data Source

PatentUS8888948B2Apparatus and method for controlling relative particle concentrations in a plasma

Publication Date: 2014.11.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

An apparatus for controlling a plasma etching process includes plasma control structure that can vary a size of a plasma flow passage, vary a speed of plasma flowing through the plasma flow passage, vary plasma concentration flowing through the plasma flow passage, or a combination thereof.