Plasma Processing Gas Introducing Unit with Dielectric Shield

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Conventional plasma processing apparatuses face issues with carbon-based product generation and adhesion in gas introducing units, leading to uneven etching and maintenance challenges due to blocked gas ejection holes.

Innovation Solution

The apparatus features a gas introducing unit on the ceiling surface with a gas retention portion and multiple gas ejection holes of flat cross-sectional shape, positioned around a recess portion, and an injector block made of conductive material, electrically grounded, with a protective film to prevent adhesion, and a dielectric window design that shields the ejection holes, reducing internal pressure and adhesion likelihood.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a conventional introducing unit with gas ejection holes is used, then process gas can be introduced to the processing container, but carbon-based products adhere to the introducing unit and block the gas ejection holes

Engineering Contradiction:
Improvegas ejection hole functionalityVSAvoidcarbon-based product adhesion
Core Design Contradiction:
ReliabilityVSObject-generated harmful factors

Solution Approach 1:

A shield portion is introduced as an intermediary component between the gas ejection holes and the plasma environment. This shield portion blocks direct exposure of the gas ejection holes to plasma, preventing carbon-based product adhesion while still allowing process gas to be introduced effectively into the processing container.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The gas ejection holes are extracted from direct exposure to the plasma environment by positioning them behind the shield portion. This separation removes the harmful plasma exposure from the gas ejection holes, preventing carbon deposition while maintaining gas introduction functionality.

Inventive Principle:
Principle #2Taking out (Extraction)

2Manufacturing precision

If gas ejection holes are blocked by adhered carbon-based products, then etching uniformity deteriorates, but increasing cleaning frequency reduces productivity

Engineering Contradiction:
Improveetching uniformityVSAvoidmaintenance operation frequency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The shield portion is installed in advance to prevent carbon-based product adhesion before it can occur. By blocking the plasma from directly exposing the gas ejection holes, the shield prevents the root cause of etching uniformity deterioration, eliminating the need for frequent maintenance operations.

Inventive Principle:
Principle #9Preliminary anti-action

3Productivity

If the introducing unit is designed with multiple components for better gas distribution, then gas introduction efficiency improves, but device complexity increases

Engineering Contradiction:
Improvegas introduction efficiencyVSAvoidintroducing unit structure
Core Design Contradiction:
ProductivityVSDevice complexity

Solution Approach 1:

The shield portion serves multiple functions simultaneously: it shields the gas ejection holes from plasma exposure, maintains gas flow distribution, and simplifies the overall structure by preventing the need for complex cleaning mechanisms. This multi-functionality improves gas introduction efficiency while avoiding increased device complexity.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This design prevents carbon-based product adhesion, ensures smooth gas introduction, maintains etching uniformity, and improves maintenance by reducing the likelihood of gas ejection hole blockages.

Implementation Method 1

a dielectric window, which is disposed on a ceiling portion of the container as a ceiling member, is shaped tapered inwardly so that the gas ejection holes are not directly seen by being shaded by the dielectric window

Methodology Applied
Scientific EffectShadow shielding: Shadow

Implementation Method 2

an injector block formed of, for example, a conductive material, and the injector block may be electrically grounded

Methodology Applied
Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

the microwaves are propagated into the processing container through a dielectric material disposed on a ceiling surface of the processing container. Then, a process gas introduced to the processing container is plasmatized by energy of the microwaves

Methodology Applied
Scientific EffectMicrowave radiation: Microwave Radiation

Implementation Method 4

a process gas introduced to the processing container is plasmatized by energy of the microwaves

Methodology Applied
Scientific EffectPlasma generation: Plasma

Data Source

PatentUS10062547B2Plasma processing apparatus
Publication Date: 2018.08.28 TOKYO ELECTRON LTD
  • US10062547B2 patent drawing
  • US10062547B2 patent drawing
  • US10062547B2 patent drawing

AI summary

In a plasma processing apparatus for processing a substrate by plasmatizing a process gas introduced into a processing container, an introducing unit which introduces the process gas is formed on a ceiling surface of the processing container; a gas retention portion which gathers the process gas supplied from the outside of the processing container through a supply passage, and a plurality of gas ejection holes which allow communication between the gas retention portion and the inside of the processing container are formed in the introducing unit; a gas ejection hole is not formed in a location of the gas retention portion that faces an opening of the supply passage; and a cross section of each of the gas ejection holes has a flat shape.