Plasma Substrate Support Heat Transfer Layer for Temperature Uniformity
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Solution Overview
Problem
Existing plasma processing techniques face challenges in efficiently adjusting the temperature of substrates and edge rings during plasma processing, as conventional heat transfer gases often fail to fully adjust temperatures when large amounts of heat are input.
Innovation Solution
A processing method involving a deformable heat transfer layer, either liquid or solid, is formed on the substrate support surface within a plasma processing chamber, allowing for efficient temperature adjustment of substrates and edge rings through the use of a heat transfer medium that can absorb and distribute heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional heat transfer gases are used for temperature adjustment, then the structure is simple, but the temperature adjustment efficiency is insufficient when large amounts of heat are input
Solution Approach 1:
A deformable heat transfer layer is introduced as an intermediary between the substrate and substrate support. This layer comprises a liquid layer and a deformable solid layer, enabling efficient thermal contact while accommodating substrate warpage. The heat transfer layer mediates heat transfer from the substrate support to the substrate, solving the problem of insufficient temperature adjustment efficiency with conventional gases.
Solution Approach 2:
The patent changes the physical state and properties of the heat transfer medium from gas to a composite liquid-solid structure. The liquid layer provides conformal contact, while the deformable solid layer maintains structural integrity and enables thermal conduction. This parameter change from gas to liquid-solid composite dramatically improves temperature adjustment efficiency.
2Manufacturing precision
If a deformable heat transfer layer is introduced, then temperature control precision is improved, but the device structure becomes more complex
Solution Approach 1:
The heat transfer layer is segmented into two distinct layers: a liquid layer in direct contact with the substrate and a deformable solid layer between the liquid layer and substrate support. This segmentation allows each layer to perform its specific function optimally - the liquid layer provides conformal contact for precise temperature control, while the solid layer provides structural support and deformability.
Solution Approach 2:
The patent uses a composite structure combining liquid and deformable solid materials in the heat transfer layer. This composite approach leverages the advantages of both materials: liquids provide conformal contact and high thermal conductivity, while deformable solids provide structural integrity and adaptability to substrate shape changes.
3Stability of the object's composition
If heat transfer gas is used, then the system is simple, but temperature uniformity across substrate and edge ring is poor
Solution Approach 1:
The deformable heat transfer layer acts as an intermediary that ensures uniform thermal contact across the entire substrate surface and edge ring. The liquid layer conformally adapts to surface irregularities, while the deformable solid layer ensures consistent contact pressure, together achieving uniform temperature distribution that gas alone cannot provide.
Solution Approach 2:
The liquid layer functions as a flexible conformal contact medium that adapts to the substrate surface topology, ensuring uniform thermal contact. This flexible approach, combined with the deformable solid layer, achieves temperature uniformity across varying surfaces that rigid gas systems cannot accomplish.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables precise and efficient temperature control of substrates and edge rings during plasma processing, improving processing outcomes by maintaining consistent temperatures and allowing for immediate adjustments as needed.
Implementation Method 1
forming a heat transfer layer for the temperature adjustment target on the support surface of the substrate support... The heat transfer layer is deformable and includes at least one of a liquid layer or a deformable solid layer
Data Source
AI summary
A processing method and corresponding device for performing plasma processing on a substrate includes placing a temperature adjustment target onto a support surface of a substrate support in a processing chamber being decompressible, forming a heat transfer layer for the temperature adjustment target on the support surface of the substrate support, and performing plasma processing on the substrate on the support surface on which the heat transfer layer is formed. The heat transfer layer is deformable and includes at least one of a liquid layer or a deformable solid layer.