Plasma Processing Holding Sheet Contact State Determination
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Solution Overview
Problem
The challenge in plasma processing is the generation of wrinkles in holding sheets and substrates due to their thinness, leading to insufficient contact between the substrate and the stage, resulting in non-uniform etching, local temperature increases, and abnormal discharging, which can damage the substrate, holding sheet, and electrostatic chuck, thereby reducing product yield.
Innovation Solution
A plasma processing method and apparatus that includes a determining process to assess the contact state between the holding sheet and the stage before plasma etching, ensuring a good contact state is maintained through the use of a fixing mechanism and a gas determination system to prevent wrinkles and ensure proper adhesion, thereby improving the plasma processing outcome.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a thin holding sheet is used to enable easy bending and handling, then the handling properties are improved, but wrinkles are generated in the holding sheet causing abnormal discharge and temperature increase
Solution Approach 1:
The holding sheet is subjected to preliminary heating before plasma processing, which pre-activates the adhesion promoter and ensures optimal bonding conditions during the subsequent plasma process, preventing wrinkles and abnormal discharge
Solution Approach 2:
The temperature of the holding sheet is controlled as a critical parameter during mounting and plasma processing. By maintaining the holding sheet at a specific temperature range, the adhesion between the holding sheet and substrate is optimized, preventing wrinkle formation while preserving the thin sheet's handling advantages
2Manufacturing precision
If the holding sheet is pressed by the stage to improve contact, then contact uniformity is improved, but wrinkles are generated due to the thin and easily bent nature of the sheet
Solution Approach 1:
The temperature of the holding sheet is elevated during the mounting process, which increases the flexibility and adhesion of the sheet material. This allows the sheet to conform to the stage surface without generating wrinkles, achieving uniform contact through thermal activation rather than mechanical pressing alone
3Productivity
If plasma processing is performed without verifying contact state, then processing efficiency is improved, but non-uniform etching and abnormal discharge occur reducing product yield
Solution Approach 1:
A contact state detection mechanism is implemented that provides real-time feedback on the contact uniformity between the holding sheet and stage. Based on this feedback, the system can adjust processing parameters or trigger re-mounting procedures, ensuring that plasma processing only proceeds when optimal contact conditions are verified, thus preventing defects and maintaining high yield
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of the product by ensuring uniform etching and preventing damage to the substrate, holding sheet, and electrostatic chuck by confirming a good contact state before plasma etching, thus maintaining the integrity of the processing equipment and improving the quality of the processed substrate.
Implementation Method 1
The electrostatic suction mechanism applies a voltage to an electrode for electrostatic chucking (hereinafter, refer to as ESC electrode), and sucks the holding sheet to the stage by Coulomb force or Johnson-Rahbeck force acting between the ESC electrode and the holding sheet.
Implementation Method 2
The electrostatic suction mechanism applies a voltage to an electrode for electrostatic chucking (hereinafter, refer to as ESC electrode), and sucks the holding sheet to the stage by Coulomb force or Johnson-Rahbeck force acting between the ESC electrode and the holding sheet.
Implementation Method 3
a plasma process of etching the substrate by exposing a surface of the substrate to plasma
Data Source
AI summary
A plasma processing method includes a mounting process of mounting a holding sheet holding a substrate in a stage provided in a plasma processing apparatus, and a fixing process of fixing the holding sheet to the stage. The plasma processing method further includes a determining process of determining whether or not a contact state of the holding sheet with the stage is good or bad after the fixing process, and a plasma etching process of etching the substrate by exposing a surface of the substrate to plasma on the stage, in a case in which the contact state is determined to be good in the determining process.