Plasma Processing Apparatus Injection Ports Ground Electrode
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Solution Overview
Problem
Batch-type plasma substrate processing apparatuses face challenges with temperature gradients and contamination due to uneven heating and the formation of unwanted thin films on inner walls, which degrade the quality and efficiency of the substrate processing process.
Innovation Solution
A batch-type plasma substrate processing apparatus where the plasma reaction part is positioned outside the processing space, decomposing process gases and supplying them into the space, reducing the need for high-temperature heating and minimizing contamination by forming plasma outside the processing space, thereby improving temperature control and process efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If hot wall-type heating means is used to raise the temperature of the processing space wall surface and substrates, then the substrate processing can proceed, but unwanted thin films are formed on the inner wall surfaces and temperature gradients occur among substrates
Solution Approach 1:
The plasma reaction part is extracted from the processing space and positioned in the separation space outside the first tube. This allows plasma decomposition of process gas to occur externally, and the decomposed gas is then supplied into the processing space through injection ports, avoiding direct plasma contact with the processing space wall surfaces and preventing thin film formation and contamination.
Solution Approach 2:
The decomposed process gas acts as an intermediary carrier. The plasma reaction part decomposes the process gas externally, and this decomposed gas is then transported into the processing space through injection ports, serving as a mediator that transfers the beneficial plasma decomposition effects without introducing the harmful plasma byproducts directly into the processing space.
2Productivity
If plasma is formed inside the processing space to promote ionization and chemical reactions, then the reaction temperature and time are reduced, but particles are separated from the inner wall by magnetic or electric fields and contaminate the substrates
Solution Approach 1:
The plasma reaction part is extracted from the processing space and positioned in the separation space outside the first tube. This allows plasma decomposition of process gas to occur externally, and the decomposed gas is then supplied into the processing space through injection ports, avoiding direct plasma contact with the processing space wall surfaces and preventing thin film formation and contamination.
3Productivity
If batch-type processing is used to process multiple substrates simultaneously, then productivity is improved, but temperature gradients are generated among substrates requiring longer reaction times
Solution Approach 1:
Multiple injection ports are strategically positioned at different locations (including both sides of the ground electrode) within the processing space to supply decomposed process gas locally to different substrate positions. This ensures uniform distribution of reactive species across all substrates regardless of their positions, achieving temperature and reaction uniformity in batch processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for more uniform gas distribution and reduced contamination, enhancing the quality and efficiency of the substrate processing by maintaining lower temperatures and preventing particle separation from the inner wall, leading to improved laminar flow and processing outcomes.
Implementation Method 1
a plasma reaction part provided outside the first tube, and configured to plasma-decompose the process gas supplied from the gas supply part and provide the decomposed process gas to the processing space
Data Source
AI summary
A substrate processing apparatus in accordance with an exemplary embodiments include: a first tube configured to provide a processing space in which a plurality of substrates are processed; a substrate support part configured to load the plurality of substrates in a first direction in the processing space; a plurality of gas supply parts provided with supply ports for supplying a process gas required for a process in which the substrates are processed; an exhaust part configured to communicate with the first tube and discharge process residues inside the processing space to the outside; and a plasma reaction part provided outside the first tube, and configured to decompose, with plasma, the process gas supplied from the gas supply part and provide the decomposed process gas to the processing space.