Plasma Microchamber Array for Scalable Substrate Processing
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Solution Overview
Problem
Traditional plasma processing systems face challenges in scalability to larger substrates without compromising throughput, as larger chambers require more purging time and energy, leading to decreased efficiency and increased costs.
Innovation Solution
The implementation of a plasma deposition processing system with an array of plasma microchambers that can be moved over a substrate, each generating plasma over a portion of the surface, allowing for efficient processing of larger substrates by reducing the volume of the plasma chamber and optimizing energy use.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the plasma processing chamber is increased in size to accommodate larger substrates, then the substrate area that can be processed increases, but the purging time increases
Solution Approach 1:
The plasma processing system is divided into multiple independent plasma sources that can be selectively activated. Instead of using one large plasma chamber that requires complete purging, the system uses multiple smaller plasma zones that can be independently controlled and purged, reducing the overall purging time while maintaining the ability to process large substrates.
Solution Approach 2:
The system employs movable plasma sources or movable substrate stages that dynamically reposition during processing. This allows the plasma processing zone to be moved across different areas of the substrate without requiring the entire chamber to be purged, enabling continuous processing and reducing downtime.
2Area of stationary object
If the plasma processing chamber is increased in size to accommodate larger substrates, then the substrate area that can be processed increases, but the throughput decreases
Solution Approach 1:
The processing system is segmented into multiple independent plasma sources that can operate simultaneously or in sequence on different regions of the substrate. This parallel processing capability increases throughput while maintaining the ability to handle large substrate areas.
Solution Approach 2:
The system maintains continuous plasma processing by using multiple plasma sources that can be sequentially activated or by moving the plasma zone continuously across the substrate surface. This eliminates idle purging time and maintains continuous productive action, thereby increasing throughput.
3Area of stationary object
If the plasma chamber volume is increased to process larger substrates, then the substrate size capacity increases, but the energy requirements increase
Solution Approach 1:
Instead of generating plasma throughout a large chamber volume, the system uses multiple localized plasma sources that generate plasma only in the immediate processing zone. This segmented approach reduces the total energy required because plasma is generated only where and when needed, rather than throughout the entire large chamber volume.
Solution Approach 2:
The system applies plasma processing locally to specific regions of the substrate using focused plasma sources. This creates high plasma density and reactivity in the local processing zone while minimizing the overall plasma volume, thereby reducing total energy consumption while maintaining effective processing of large substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables scalable plasma processing without sacrificing throughput, reducing material and energy costs while maintaining consistency and efficiency across larger substrate sizes.
Implementation Method 1
The array of plasma microchambers is configured to generate a plasma using the process gas to deposit a layer over the at least first portion of the surface to be processed
Implementation Method 2
A radio frequency power supply is connected to at least one electrode of the processing head. The array of plasma microchambers is configured to generate a plasma using the process gas
Data Source
AI summary
A plasma processing method is provided. The method includes receiving a substrate in a substrate support that is configured to be movable along a linear path. The method includes providing at least one process gas into a plasma microchamber. The plasma microchamber is disposed in a processing head having a length that is at least longer than a diameter of the substrate, and said length is perpendicular to said linear path. The method includes generating a plasma in the plasma microchamber by applying power to the plasma microchamber and applying a bias power to the substrate support. The plasma microchamber has an open side process area that is oriented and directed over a surface to be processed, and the open side process area is less than an area of the surface to be processed. The method includes translating said substrate support along said linear path while said microchamber generates the plasma in the plasma microchamber for exposing said plasma over the substrate. The translating of said substrate support along the linear path while generating said plasma via said microchamber provides for exposing said plasma across the substrate. The plasma is used for either depositing or etching a material.