Plasma Phase Control for Uniform Substrate Processing
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Solution Overview
Problem
Existing plasma processing technologies struggle to uniformly control the electric field distribution in a dielectric window, which affects the plasma distribution on a substrate, especially when the arrangement of electromagnetic wave radiating devices is fixed.
Innovation Solution
A plasma processing method and apparatus that utilize phase control of electromagnetic waves radiated from multiple devices to alter the electric field distribution in the dielectric window, regardless of the devices' arrangement, thereby allowing for precise control of plasma distribution on a substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electromagnetic wave radiating devices are arranged in a fixed configuration, then the device structure is simple, but the electric field distribution in the dielectric window cannot be uniformly controlled
Solution Approach 1:
The patent applies phase modulation to make the electromagnetic wave radiating devices dynamically adjustable. By controlling the phase of each radiating device independently, the system can dynamically change the electric field distribution pattern in the dielectric window without physically moving or rearranging the devices, thus maintaining structural simplicity while achieving precise control over electric field distribution.
Solution Approach 2:
The patent changes the phase parameter of the electromagnetic waves radiated by each device to control the electric field distribution. By adjusting the phase parameter of individual radiating devices, the system can alter the interference pattern and resulting electric field distribution in the dielectric window, enabling precise control without modifying the physical arrangement of the devices.
2Manufacturing precision
If the arrangement of electromagnetic wave radiating devices is optimized for uniform plasma distribution, then plasma uniformity is improved, but the system loses flexibility to adapt to different processing requirements
Solution Approach 1:
The patent makes the system adaptable by enabling dynamic phase control of each electromagnetic wave radiating device. This allows the system to switch between different electric field distribution patterns as needed, providing flexibility to adapt to various processing requirements while maintaining optimized plasma uniformity when required, without being locked into a single fixed arrangement.
Solution Approach 2:
The patent creates a multi-functional system where the same fixed arrangement of radiating devices can produce multiple different electric field distribution patterns through phase control. This universal approach allows one physical configuration to serve multiple processing needs, enhancing system versatility without requiring multiple specialized arrangements.
3Manufacturing precision
If phase control of electromagnetic waves is implemented, then electric field distribution control is improved, but the control system complexity increases
Solution Approach 1:
The patent replaces complex mechanical adjustment systems with electronic phase control. Instead of using mechanical means to physically reposition or reconfigure radiating devices to change electric field distribution, the system uses electronic phase modulation, which is simpler to implement and control, thereby reducing overall system complexity while maintaining precise control capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables flexible control of plasma distribution on a substrate by changing the electric field distribution in the dielectric window, ensuring uniform plasma processing even with fixed electromagnetic wave radiating device arrangements.
Implementation Method 1
a plurality of radiating devices configured to radiate a plurality of electromagnetic waves
Implementation Method 2
processing the substrate using localized plasma generated from a gas supplied between the dielectric window and the stage
Implementation Method 3
a dielectric window disposed between the plurality of radiating devices and the stage
Data Source
AI summary
There is provided a plasma processing method in a plasma processing apparatus including a chamber, a stage on which a substrate is placed in the chamber, a plurality of radiating devices configured to radiate a plurality of electromagnetic waves, and a dielectric window disposed between the plurality of radiating devices and the stage. The method comprises: preparing the substrate on the stage; controlling a phase of at least one of the plurality of electromagnetic waves radiated from the plurality of radiating devices; radiating the plurality of electromagnetic waves into the chamber from the plurality of radiating devices; and processing the substrate using localized plasma generated from a gas supplied between the dielectric window and the stage.