Plasma Chamber Ring Lift Structure for Precise Annular Positioning
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Solution Overview
Problem
Existing plasma processing apparatuses face challenges in accurately positioning annular members due to mechanical differences and thermal expansion, leading to potential misalignment and damage during replacement, which affects the precision and integrity of the plasma processing.
Innovation Solution
A plasma processing apparatus is designed with an insulating ring and conductive ring configuration, featuring through holes and grooves that accommodate lift pins, allowing for precise positioning and support of the annular members through a lifter mechanism, enhancing installation precision and reducing mechanical stress.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional positioning methods are used for annular members, then the device structure is simple, but positioning precision deteriorates due to mechanical differences and thermal expansion
Solution Approach 1:
The positioning system is segmented into multiple independent components: through holes in the insulating ring, grooves in the conductive ring, and lift pins. Each component performs a specific function (positioning, support, or lifting), allowing the system to achieve high positioning precision through the coordinated action of segmented elements rather than relying on a single complex positioning mechanism.
Solution Approach 2:
The conductive ring is nested within the insulating ring, with the grooves on the conductive ring aligning with the through holes in the insulating ring. The lift pins are inserted through the insulating ring to engage with the grooves of the conductive ring. This nested configuration allows multiple positioning and support functions to be integrated in a compact structure, achieving high positioning precision without excessive structural complexity.
2Reliability
If conventional support methods are used for annular members, then the device structure is simple, but reliability deteriorates due to potential misalignment and damage during replacement
Solution Approach 1:
The through holes and grooves are pre-formed with precise dimensions and positions before assembly. The lift pins are pre-positioned to engage with the grooves. This preliminary preparation ensures that when the annular members are installed or replaced, the alignment is already established, preventing misalignment and damage during the replacement process, thereby improving installation reliability.
Solution Approach 2:
The lift pins serve as intermediary elements between the insulating ring (with through holes) and the conductive ring (with grooves). They mediate the positioning and support functions, ensuring proper alignment and reducing mechanical stress during installation and replacement. This intermediary mechanism improves reliability by preventing direct contact and potential damage between the ring components.
3Manufacturing precision
If precise positioning structures are implemented, then positioning precision is improved, but mechanical stress increases on the components
Solution Approach 1:
The through holes in the insulating ring and grooves in the conductive ring are designed with specific local geometries: the through holes have a first width in the radial direction and a second width in the circumferential direction, while the grooves have corresponding dimensions. This local quality differentiation allows precise positioning at critical interfaces while distributing mechanical stress across larger contact areas, reducing peak stresses on individual components.
Solution Approach 2:
The lift pins are designed to engage with the grooves in a manner that provides cushioning against mechanical stress. The grooves are formed to accommodate the lift pins with appropriate clearance and contact surfaces, preventing concentrated stress points. This beforehand cushioning design protects the components from damage during installation and operation while maintaining positioning precision.
Data Source
AI summary
There is a plasma processing apparatus, comprising: a plasma processing chamber; a substrate support having a ring supporting surface; an insulating ring disposed on the ring supporting surface, the insulating ring having at least three through holes, each of the through holes having upper and lower hole portions, the lower hole portion having a flaring shape; a conductive ring supported by the insulating ring, the conductive ring having at least three grooves on a lower surface, the grooves corresponding to the through holes; at least three lift pins disposed below the ring supporting surface, the lift pins corresponding to the grooves, each of the lift pins having upper and lower supporting portions, the upper supporting portion being configured to support the conductive ring, the lower supporting portion configured to support the insulating ring; and at least one actuator configured to vertically move the pins.