Plasma Scrubber for Semiconductor Process Gas Without Combustion Emissions

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Solution Overview

Problem

Existing scrubbers used for purifying semiconductor process gases are complex and generate large amounts of harmful exhaust materials, such as carbon dioxide and nitrogen oxide, due to the combustion process.

Innovation Solution

A scrubber system incorporating a plasma treatment system, a hydrogen supply system, and a wet treatment system, which uses plasma to decompose semiconductor process gases in the presence of hydrogen, thereby reducing harmful emissions and simplifying the equipment structure.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If a burner is used to combust the semiconductor process gas, then the semiconductor process gas is decomposed or purified, but an exhaust gas includes a lot of harmful materials such as carbon dioxide and nitrogen oxide and an amount of the exhaust gas is large

Engineering Contradiction:
Improveharmful materials in exhaust gasVSAvoidamount of exhaust gas
Core Design Contradiction:
Object-affected harmful factorsVSQuantity of substance

Solution Approach 1:

The patent changes the fundamental parameter of the decomposition method from thermal combustion to plasma decomposition. This parameter change eliminates the need for combustion reactions that produce CO2 and NOx, thereby reducing harmful materials in exhaust gas without increasing exhaust volume

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The patent replaces the mechanical/thermal combustion system with a plasma-based decomposition system. The plasma treatment system uses electromagnetic energy to decompose the semiconductor process gas directly, avoiding the combustion chain reaction that generates harmful exhaust materials

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Object-affected harmful factors

If a burner and supply line for combustion gas are included in the scrubber, then the semiconductor process gas is combusted, but the equipment becomes complicated

Engineering Contradiction:
Improvepurification of semiconductor process gasVSAvoidequipment structure
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The patent extracts and removes the combustion-related components (burner and combustion gas supply line) from the scrubber system. By eliminating these components and replacing them with a plasma treatment system, the equipment structure is simplified while maintaining the gas purification function

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The plasma treatment system serves multiple functions: it decomposes the semiconductor process gas, eliminates harmful emissions, and does so without requiring separate combustion gas supply infrastructure. This multi-functional approach reduces overall equipment complexity

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed scrubber system effectively reduces the amount of harmful materials in the exhaust gas and decreases the exhaust load, while also simplifying the equipment structure and reducing operational complexity.

Implementation Method 1

a plasma treatment system that performs a plasma treatment in which a process gas and a hydrogen gas are reacted using plasma

Methodology Applied
Scientific EffectPlasma: Plasma

Implementation Method 2

The hydrogen supply system may include an electrolysis unit

Methodology Applied
Scientific EffectElectrolysis: Electrolysis

Data Source

PatentUS20250132137A1Scrubber and treatment method of semiconductor process gas using the same
Publication Date: 2025.04.24 SAMSUNG ELECTRONICS CO LTD
  • US20250132137A1 patent drawing
  • US20250132137A1 patent drawing
  • US20250132137A1 patent drawing

AI summary

A scrubber includes a plasma treatment system, a hydrogen supply system, and a wet treatment system. The plasma treatment system performs a plasma treatment in which a process gas and a hydrogen gas are reacted using plasma. The hydrogen supply system supplies the hydrogen gas to the plasma treatment system. The wet treatment system performs a wet treatment in which a by-product generated by the plasma treatment is wet-treated.