Plasma Processing Stage Heating for Holding Sheet Flatness
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Solution Overview
Problem
Plasma processing of thin substrates held by conveyance carriers is hindered by warping of holding sheets, leading to abnormal discharge, temperature increases, and processing irregularities due to electrostatic chuck mechanisms, which fail to maintain proper contact and alignment.
Innovation Solution
A plasma processing apparatus and method that involves heating the stage before applying voltage to the electrostatic chuck mechanism, allowing the holding sheet to expand and maintain contact with the stage, and using an elevation mechanism to support the conveyance carrier in a way that prevents wrinkling, ensuring consistent plasma processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the electrostatic chuck mechanism is used to absorb the conveyance carrier on the stage, then the conveyance carrier can be held firmly for plasma processing, but the holding sheet may warp and wrinkle due to electrostatic forces and cooling
Solution Approach 1:
The holding sheet is heated to a predetermined temperature before the conveyance carrier is absorbed on the stage by the electrostatic chuck mechanism. This preliminary heating prevents warping and wrinkling by reducing the sheet's susceptibility to deformation under electrostatic forces and cooling during plasma processing.
Solution Approach 2:
The temperature of the holding sheet is changed from ambient temperature to a predetermined elevated temperature before absorption. This parameter change (temperature increase) modifies the physical properties of the holding sheet to prevent warping and wrinkling during the plasma processing operation.
2Manufacturing precision
If the holding sheet is heated to prevent warping, then uniform plasma processing can be achieved, but additional heating equipment and process control are required
Solution Approach 1:
The stage structure serves dual functions: it acts as both the plasma processing chamber floor and a heating element for the holding sheet. The heating unit is integrated into the stage, allowing the same component to provide both thermal conditioning and plasma processing support, thereby avoiding additional complex heating equipment.
3Temperature
If the conveyance carrier is absorbed on the cooled stage, then effective cooling during plasma processing is achieved, but the holding sheet may wrinkle and cause abnormal discharge
Solution Approach 1:
The holding sheet is heated to a predetermined temperature before absorption on the cooled stage. This preliminary heating creates a temperature buffer that prevents immediate warping and wrinkling, allowing the sheet to maintain its flatness even as cooling begins during plasma processing, thereby preventing abnormal discharge.
Solution Approach 2:
By pre-heating the holding sheet, the system creates a thermal cushion against the subsequent cooling effect. This beforehand cushioning prevents the sheet from warping and wrinkling when the cooling starts, ensuring stable plasma processing without abnormal discharge at wrinkles.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the yield of plasma processing by preventing wrinkling and temperature irregularities, ensuring uniform processing and reducing the risk of damage to substrates and equipment.
Implementation Method 1
heating the stage before applying voltage to the electrostatic chuck mechanism, allowing the holding sheet to expand and maintain contact with the stage
Implementation Method 2
The electrostatic chuck mechanism applies a voltage to an electrostatic chuck electrode (hereinafter referred to as an ESC electrode) disposed inside the stage and causes the conveyance carrier to be absorbed on the stage by Coulomb force
Implementation Method 3
a plasma generation unit which generates plasma in the reaction chamber
Implementation Method 4
a support portion which supports the conveyance carrier between a stage-mounted position on the stage and a transfer position that is distant from the stage upward; and an elevation mechanism which elevates and lowers the support portion relative to the stage
Data Source
AI summary
A plasma processing apparatus includes: a reaction chamber; a plasma generation unit; a stage disposed inside the reaction chamber; an electrostatic chuck mechanism including an electrode portion inside the stage; a heater inside the stage; a support portion which supports a conveyance carrier between a stage-mounted position on the stage and a transfer position distant from the stage upward; and an elevation mechanism which elevates and lowers the support portion relative to the stage. In a case in which the conveyance carrier is mounted on the stage by lowering the support portion, application of voltage to the electrode portion is started in a state that the stage is being heated, and the plasma generation unit generates plasma after at least a part of an outer circumferential portion of a holding sheet holding the conveyance carrier contacts the stage and also after the heating of the stage is stopped.