Plasma Processing Tray with Electrostatic Attraction and Heat Conduction Gas
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing plasma processing apparatuses face inefficiencies in substrate cooling, non-uniform plasma processing due to clamp rings, and inadequate positioning accuracy, particularly at the substrate's outer peripheral edge.
Innovation Solution
A plasma processing apparatus with a tray having substrate accommodation holes that expose the substrate's lower surface, supported by a dielectric member with electrostatic attraction and heat conduction gas, eliminating the need for clamp rings and enhancing thermal conductivity and positioning precision.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the substrate is electrostatically attracted indirectly to the substrate susceptor via the tray, then the substrate can be held on the susceptor, but the cooling efficiency is insufficient
Solution Approach 1:
The invention extracts the substrate from the tray and places it directly on the substrate susceptor, eliminating the tray as an intermediate component. This direct contact enables efficient thermal conduction for cooling while maintaining electrostatic attraction, resolving the contradiction between cooling efficiency and device complexity.
2Reliability
If a clamp ring is used to pressurize the substrate against the susceptor, then the substrate can be fixed, but plasma processing becomes non-uniform at the outer peripheral edge
Solution Approach 1:
The invention removes the clamp ring from the system and replaces mechanical pressurization with electrostatic attraction. This eliminates the physical obstruction at the substrate periphery that caused plasma processing non-uniformity, while maintaining reliable substrate fixation through electrostatic forces.
Solution Approach 2:
The invention substitutes the mechanical clamp ring system with an electrostatic attraction system. The electrostatic field provides uniform holding force across the substrate without physical contact or mechanical pressure points, enabling both reliable fixation and uniform plasma processing.
3Productivity
If the tray structure is used to accommodate the substrate, then batch processing is enabled, but positioning accuracy is insufficient
Solution Approach 1:
The invention introduces a positioning electrode as an intermediary component between the substrate susceptor and the substrate. This positioning electrode provides precise location reference for the substrate, improving positioning accuracy while maintaining the tray structure for batch processing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution achieves high cooling efficiency, precise temperature control, and uniform plasma processing across the entire substrate surface, including the outer peripheral edge, while improving positioning accuracy.
Implementation Method 1
an electrostatic attraction electrode embedded therein for electrostatically attracting the substrate to the substrate placement surface
Implementation Method 2
the substrate to be cooled with high cooling efficiency, and the substrate temperature to be controlled with high accuracy
Data Source
AI summary
A tray for a dry etching apparatus includes substrate accommodation holes penetrating a thickness direction and a substrate support portion supporting an outer peripheral edge portion of a lower surface of a substrate. An upper portion includes a tray support surface supporting a lower surface of the tray, substrate placement portions on each of which a lower surface of the substrate to be placed, and a concave portion for accommodating the substrate support portion. A dc voltage applying mechanism applies a dc voltage to an electrostatic attraction electrode. A heat conduction gas supply mechanism supplies a heat conduction gas between the substrate and substrate placement portion. During carrying of the substrate, the outer peripheral edge of the lower surface of the substrate is supported by the substrate accommodation hole. During processing of the substrate, the substrate support portion is accommodated in the concave portion.