Plasma-Treated Oxide Layer for Flexible Device Separation
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Solution Overview
Problem
The existing methods for separating functional elements from flexible substrates in device manufacturing often face challenges with low yield and high stress requirements, which can damage the elements and reduce productivity, especially in lightweight, thin, or flexible devices.
Innovation Solution
A separation method involving the formation of a separation layer, followed by plasma treatment under atmospheres containing nitrous oxide, silane, and ammonia, which forms a thin oxide layer to facilitate easy separation while maintaining mechanical strength and light extraction efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If high stress is applied to separate the layer to be separated from the substrate, then separation can be achieved, but cracks may be generated in the layer and functional elements may be damaged
Solution Approach 1:
The invention introduces a separation layer as an intermediate layer between the substrate and the layer to be separated. This segmentation allows the separation process to occur at the interface between the substrate and separation layer, rather than directly at the interface between the substrate and the functional element layer, thereby preventing damage to the functional elements while achieving effective separation.
Solution Approach 2:
The separation layer acts as an intermediary between the substrate and the layer to be separated. By providing this intermediate layer with specific material properties (such as controlled adhesion strength and mechanical properties), the invention enables easy separation without applying high stress that would damage the functional elements, thus resolving the contradiction between separation ease and element integrity.
2Ease of operation
If conventional separation methods are used, then separation can be achieved, but the yield of the manufacturing process is reduced
Solution Approach 1:
The separation layer is formed in advance during the manufacturing process, before the separation step is executed. This preliminary action of creating a dedicated separation layer with controlled properties ensures that when separation is needed, it can be performed easily and reliably, thereby improving manufacturing yield without compromising separation capability.
Solution Approach 2:
The invention changes the material parameters of the separation layer (such as composition, thickness, and adhesion properties) to optimize both separation ease and manufacturing yield. By controlling these parameters, the separation process becomes more reliable and less prone to damaging functional elements, thus improving overall manufacturing yield.
3Ease of operation
If a thick separation layer is used to improve separability, then separation becomes easier, but light extraction efficiency of light-emitting devices is reduced
Solution Approach 1:
The invention applies the principle of local quality by creating a separation layer with specific localized properties - thin enough to maintain light extraction efficiency but with controlled adhesion characteristics that enable easy separation. The layer has different properties at different interfaces (substrate-separation layer and separation layer-layer to be separated), allowing it to fulfill multiple functions simultaneously.
Solution Approach 2:
The separation layer may be composed of composite materials or have a stacked structure with different material layers, each contributing specific properties. This allows the layer to be thin enough for good light extraction while maintaining sufficient mechanical strength and controlled adhesion for easy separation, thus resolving the contradiction between separability and light extraction efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method improves the yield and productivity of the separation process, reduces the force required for separation, and enhances the light extraction efficiency of light-emitting devices by forming a thin, reliable oxide layer that minimizes damage to the functional elements.
Implementation Method 1
a second step of performing plasma treatment on a surface of the separation layer
Implementation Method 2
The plasma treatment is performed under an atmosphere containing nitrogen, oxygen, silicon, and hydrogen
Implementation Method 3
a fourth step of heating the separation layer and the layer to be separated
Data Source
AI summary
A method for manufacturing a flexible semiconductor device is disclosed. The method includes: forming a separation layer of a metal over a substrate; treating the separation layer with plasma under an atmosphere containing nitrogen, oxygen, silicon, and hydrogen; forming a layer over the plasma-treated separation layer, the layer being capable of supplying hydrogen and nitrogen to the separation layer; forming a functional layer over the separation layer; performing heat treatment to promote the release of hydrogen and nitrogen from the layer; and separating the substrate at the separation layer. The method allows the formation of an extremely thin oxide layer over the separation layer, which facilitates the separation, reduces the probability that the oxide layer remains under the layer, and contributes to the increase in efficiency of a device included in the functional layer.