Plasma Chamber Temperature Profiling for Dielectric Window Stress Control

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Solution Overview

Problem

Thermal stress due to non-uniform heating causes damage to brittle components in substrate processing chambers, such as dielectric windows, due to uneven heat and cooling distributions in these systems.

Innovation Solution

A system that uses temperature sensors to estimate temperature distributions across components, calculates stress using heat input models, and controls process parameters to limit stress through coil power and coolant management, allowing for real-time stress monitoring and mitigation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If non-uniform heating is applied to the processing chamber, then processing efficiency is improved, but thermal stress on components increases causing damage

Engineering Contradiction:

Improveprocessing efficiencyVSAvoidcomponent integrity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The dielectric window is divided into multiple heat zones (first, second, third heat zones) with different heating and cooling configurations. Each zone can be independently controlled to manage thermal stress distribution, allowing non-uniform heating for processing efficiency while preventing excessive thermal stress through localized thermal management

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different portions of the dielectric window are provided with different heating and cooling characteristics. The first heat zone has different thermal management parameters than the second and third heat zones, allowing each region to be optimized for its specific thermal requirements, thus maintaining component integrity under non-uniform heating conditions

Inventive Principle:

Principle #3Local quality

2Strength

If uniform heating is applied to the processing chamber, then thermal stress on components is reduced, but processing efficiency decreases

Engineering Contradiction:

Improvecomponent integrityVSAvoidprocessing efficiency

Core Design Contradiction:

StrengthVSProductivity

Solution Approach 1:

The processing chamber is segmented into multiple heat zones with independent thermal control. This allows the system to apply uniform heating when needed for component protection while enabling non-uniform heating patterns in specific zones when processing efficiency is prioritized, thus resolving the contradiction between component integrity and processing efficiency

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The heating and cooling system is made dynamically adjustable, allowing the thermal management parameters of different heat zones to be changed in real-time based on processing requirements. This dynamic control enables the system to switch between uniform and non-uniform heating modes, balancing component integrity and processing efficiency as needed

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively limits thermal stress on components, preventing damage by enabling timely adjustments to heat inputs and process conditions, ensuring the longevity of components like dielectric windows in substrate processing systems.

Implementation Method 1

a plurality of sensors configured to sense temperatures at a plurality of locations of the component during the process

Methodology Applied

Scientific EffectTemperature sensing:

Implementation Method 2

a controller configured to interpolate the temperatures to estimate a temperature distribution across the component

Methodology Applied

Scientific EffectInterpolation:

Implementation Method 3

estimate the stress on the component during the process... Thermal stress due to non-uniform heating causes damage to brittle components

Methodology Applied

Scientific EffectThermal stress: Thermal Expansion

Implementation Method 4

a coil arranged on the dielectric window to generate plasma in the processing chamber

Methodology Applied

Scientific EffectPlasma generation: Plasma

Implementation Method 5

a plenum arranged on the dielectric window to flow a coolant

Methodology Applied

Scientific EffectCooling: Cooling

Implementation Method 6

controls process parameters to limit stress through coil power and coolant management

Methodology Applied

Scientific EffectThermal stress control: Thermal Expansion

Data Source

PatentUS20230274919A1Controlling temperature profiles of plasma chamber components using stress analysis

Publication Date: 2023.08.31 LAM RES CORP

AI summary

A system for estimating stress on a component of a processing chamber during a process includes a plurality of sensors configured to sense temperatures at a plurality of locations of the component during the process and a controller a controller configured to interpolate the temperatures to estimate a temperature distribution across the component and to estimate the stress on the component during the process. A method of estimating stress on a component of a processing chamber during a process includes sensing temperatures at a plurality of locations of the component during the process, interpolating the temperatures to estimate a temperature distribution across the component, and estimating the stress on the component during the process.