Plastic-Encapsulated Silicon Photonic Packaging for Fiber Alignment
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Solution Overview
Problem
Conventional silicon photonic chip packaging methods face challenges such as chip damage during laser engraving, alignment accuracy issues between fiber optics and optical devices, and high thermal resistance leading to heat dissipation problems and increased material costs.
Innovation Solution
The proposed silicon photonic chip package module includes a transparent cushioning material layer covering the port of the silicon photonic chip, a plastic encapsulation layer with grooves for fiber optics, and a metal interconnect layer replacing conventional metal wires, allowing direct optical connection to a fiber optic and reducing alignment errors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional COB packaging with metal wires is used, then electrical connections are established, but thermal energy accumulates causing PCB burning risk and requiring heat sinks
Solution Approach 1:
The patent replaces the conventional metal wire mechanical/electrical connection system with a direct optical connection system. The silicon photonic chip is optically coupled to the optical converter chip through transparent adhesive, eliminating the need for metal wires that generate excessive heat. This substitution resolves the thermal energy accumulation problem by removing the resistive heating mechanism inherent in metal wire connections.
2Reliability
If transparent organic optically conductive material is used, then optical connection is achieved, but signal noise is introduced due to signal mismatch
Solution Approach 1:
The patent changes the material parameter from transparent organic optically conductive material to transparent inorganic adhesive material. This parameter change eliminates signal noise because inorganic materials have better optical compatibility with glass fiber optics, reducing refractive index mismatch and associated signal degradation. The transparent adhesive maintains optical transparency while providing superior signal transmission characteristics.
3Ease of manufacture
If chips are spaced at 500 μm distance, then assembly is simplified, but device shrinkage is impossible reducing competitiveness
Solution Approach 1:
The patent merges the silicon photonic chip and optical converter chip into a tightly integrated package structure. By using chip-scale packaging with the silicon photonic chip directly mounted on the optical converter chip, the distance between components is reduced from 500 μm to minimal spacing. This merging enables device shrinkage while maintaining assembly feasibility through precision mounting structures and aligned bonding processes.
4Device complexity
If laser etching groove is formed for fiber optic reception, then direct optical connection is achieved, but silicon photonic chip is likely to be damaged
Solution Approach 1:
The patent performs preliminary protective actions by coating the silicon photonic chip with a protective layer before laser etching. This protective coating prevents laser damage to the chip during groove formation. The groove is then etched in the substrate to receive the fiber optic, and the protective coating remains intact on the chip, preserving chip integrity while enabling the simplified direct optical connection structure.
5Measurement precision
If high alignment accuracy is required for fiber optic connection, then optical connection quality is improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent implements self-alignment mechanisms through precision mounting structures and aligned bonding processes. The mounting structure includes features that automatically guide and position the fiber optic in the etched groove, and the bonding process aligns the silicon photonic chip port with the fiber optic end face. These self-service alignment features reduce the need for complex external alignment equipment and high-skill manual operations, lowering manufacturing complexity while maintaining connection quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the optical device structure, reduces material costs, minimizes noise from signal mismatches, protects the chip from damage, and enhances alignment accuracy by compensating for alignment errors, thereby improving the efficiency and competitiveness of the optical device.
Implementation Method 1
a transparent cushioning material layer provided on said side surface of the silicon photonic chip so as to cover the port
Implementation Method 2
a plastic encapsulation layer, which at least surrounds the silicon photonic chip at its side surfaces and thus at least circumferentially encapsulates the silicon photonic chip
Data Source
AI summary
The present invention provides a photonic chip package module based on plastic encapsulation, which includes: a silicon photonic chip having a top surface, a bottom surface and side surfaces and incorporating an optical signal processing element, a port connected to the optical signal processing element is provided on one of the side surfaces; a transparent cushioning material layer provided on said side surface of the silicon photonic chip so as to cover the port; and a plastic encapsulation layer, which at least surrounds the silicon photonic chip at its side surfaces and at least circumferentially encapsulates the silicon photonic chip, a groove for receiving a fiber optic therein is provided in the plastic encapsulation layer, which extends towards the port and terminates at one end within the transparent cushioning material layer, thereby allowing the port to be optically connected to the fiber optic and to receive an optical signal.