Plastic Substrate Heat Stabilization via Organic Film Coating
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Solution Overview
Problem
The existing methods for fabricating flexible display devices using plastic substrates face challenges with non-uniformity and heat-induced deformation, particularly with materials like polyethylene naphthalate (PEN), which leads to instability and increased manufacturing costs due to the use of more expensive polyethersulfone (PES) substrates.
Innovation Solution
A method involving the use of an organic film coating on the plastic substrate, followed by heat treatment to harden and level the surface, reducing heat directivity and enhancing uniformity, thereby stabilizing the substrate during the array process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If inexpensive plastic substrates like PEN are used instead of PES, then manufacturing cost is reduced, but heat stability and fabrication process stability deteriorate due to lower glass transition temperature and heat-induced deformation
Solution Approach 1:
The patent applies preliminary heat treatment to the plastic substrate before the array fabrication process. This pre-treatment stabilizes the substrate by reducing future deformation caused by heat generated during subsequent array processing, thereby improving fabrication stability while maintaining cost advantages of using PEN substrates
Solution Approach 2:
The patent changes the temperature parameter during heat treatment processes. By controlling heat treatment at specific temperatures (e.g., 180°C or 200°C for extended periods), the substrate's thermal properties are optimized to reduce deformation during array fabrication, resolving the contradiction between cost and stability
2Reliability
If heat treatment is applied to reduce deformation, then fabrication stability improves, but substrate deformation increases due to heat directivity in materials like PEN
Solution Approach 1:
The patent performs heat treatment as a preliminary step before array fabrication. This pre-treatment causes controlled deformation that stabilizes the substrate's thermal response, so that subsequent heat exposure during array processing causes minimal additional deformation, improving overall fabrication stability
Solution Approach 2:
The patent applies preliminary heat treatment to counteract future heat-induced deformation. By pre-exposing the substrate to heat and allowing controlled deformation, the substrate becomes resistant to further deformation during array fabrication, effectively preventing the harmful effect of heat directivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach allows for the effective formation of uniform wire lines and thin films, reduces manufacturing costs by utilizing inexpensive plastics like PEN, and improves the overall stability and yield of the display device fabrication process.
Implementation Method 1
applying heat to the plastic substrate over which the organic film is spread to conduct heat to the plastic substrate
Implementation Method 2
harden the organic film at the same time
Data Source
AI summary
This invention relates to a fabricating method of a plastic substrate adapted to improve the stability of a display device fabrication process. The fabrication process utilizes the plastic substrate, which is inexpensive and easy to obtain. A fabricating method according to an embodiment of the present invention includes providing a plastic substrate; spreading an organic film on the plastic substrate; and applying heat to the plastic substrate over which the organic film is spread to conduct heat to the plastic substrate and to harden the organic film at the same time.