Platen-Linkage Assembly Footprint Reduction
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Solution Overview
Problem
Current injection-molding systems face challenges in optimizing the footprint of platen-linkage assemblies, which affects the overall system's efficiency and space utilization during mold opening and closing operations.
Innovation Solution
A platen-linkage assembly featuring a pair of supports movably guided along linear rails, mold-carrier sections, and primary links rotatably coupled between the mold-carrier sections and supports, allowing for synchronized movement and minimized system footprint by positioning the assembly within the width of the stationary and movable platens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If traditional platen-linkage assemblies are used in injection-molding systems, then the mold can be supported and moved between open and closed positions, but the system occupies excessive horizontal space and has a large footprint
Solution Approach 1:
The patent repositions the linkage assembly components vertically within the platen depth rather than extending them horizontally. The supports are positioned between the stationary and movable platens, and the links connect these supports in a vertical arrangement, transforming the horizontal space-consuming configuration into a vertical one that fits within the platen depth, thereby reducing the system footprint while maintaining operational efficiency
Solution Approach 2:
The linkage assembly is nested within the space between the stationary and movable platens. The supports are positioned in the gap between platens, and the links are arranged to connect these supports without extending beyond the platen boundaries, effectively nesting the entire linkage mechanism within the existing platen structure to minimize external footprint
2Area of stationary object
If the linkage assembly is positioned within the width of the platens to minimize footprint, then space utilization is improved, but the complexity of synchronizing movement between multiple mold-carrier sections increases
Solution Approach 1:
The linkage assembly is segmented into multiple independent supports and links, with each support-carrier combination able to move independently along its own linear guide rails. Each link connects corresponding supports on different platens, creating modular units that can be synchronized through the mechanical coupling of the links rather than requiring a complex centralized control system
Solution Approach 2:
The links serve as intermediary elements that mechanically couple the supports on the stationary platen with those on the movable platen. These links transmit motion and force between the platens, automatically synchronizing the movement of multiple mold-carrier sections without requiring complex electronic controls or additional synchronization mechanisms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the system's footprint options by minimizing the overall system footprint while maximizing the mold footprint, enabling efficient mold operation and article removal or injection.
Implementation Method 1
a pair of supports (110A, 110B) that are offset from one another and that are movably guidable along a respective one of a pair of linear-guide rails (106A, 106B)
Implementation Method 2
a pair of primary links (116A, 116B) that are rotatably coupled with one another and that are positioned between a chosen one of: (i) the mold-carrier sections (114A, 114B), and (ii) the pair of supports (110A, 110B)
Data Source
AI summary
Disclosed is a platen-linkage assembly, including: (i) a pair of supports being movably guidable along a respective one of a pair of linear-guide rails, (ii) mold-carrier sections being configured to support a mold stack; and (iii) a pair of primary links being rotatably coupled with and being positioned between a chosen one of: (i) the mold-carrier sections, and (ii) the pair of supports.