Plating Plate With Asymmetric Concentric Pores For Uniform Film Thickness
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The terminal effect in electrolytic plating leads to non-uniform film thickness distribution due to varying porosity in plating plates, causing local anisotropy and affecting the distribution of pores on substrates.
Innovation Solution
A plating plate with concentric circular pores of different diameters, arranged such that three pores on adjacent reference circles have centers out of alignment on an arbitrary radius, is used between the substrate and anode, along with a method to determine the optimal porosity, pore diameter, and region radius to suppress local anisotropy by distributing pores uniformly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If pores are formed through the plate with varying porosity from region to region, then the plating process can be performed, but local anisotropy of pore distribution occurs causing non-uniform film thickness
Solution Approach 1:
The patent applies asymmetry by deliberately arranging pores on concentric circles with different diameters rather than uniform distribution. The pores are positioned at specific radial distances from the center, creating an asymmetric pattern that compensates for the terminal effect and achieves uniform film thickness across the substrate surface.
Solution Approach 2:
The patent implements local quality by varying the pore distribution characteristics in different regions of the plate. Each concentric circle contains pores at specific radial positions, and the density and arrangement of pores differ between regions to optimize local plating uniformity while maintaining overall consistency.
2Object-affected harmful factors
If the plate is made of electrically insulating material, then terminal effect influence is reduced, but pore distribution uniformity may be adversely affected
Solution Approach 1:
The patent uses asymmetric pore arrangement on concentric circles to compensate for any residual terminal effect while maintaining uniform film thickness. This asymmetric distribution ensures that even with electrically insulating material, the pore density remains optimized across different regions.
3Device complexity
If pores are arranged uniformly on the plate, then pore distribution is simplified, but local anisotropy cannot be suppressed
Solution Approach 1:
The patent deliberately introduces asymmetry in pore arrangement by positioning pores on concentric circles with different diameters. This asymmetric pattern is specifically designed to suppress local anisotropy and achieve uniform film thickness, demonstrating that controlled complexity improves performance.
Solution Approach 2:
The patent applies different pore arrangement characteristics to different regions through the concentric circle design. Each region has optimized pore density and positioning tailored to its specific radial position, achieving local quality optimization that suppresses anisotropy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses local anisotropy in pore distribution, ensuring a more uniform film thickness and porosity across the substrate, thereby improving the plating process.
Implementation Method 1
The plurality of circular pores are arranged on at least three reference circles that are concentric with each other and are different from one another in diameter
Implementation Method 2
electrolytic plating has been known as a method of performing the wiring, the formation of bumps, and the like
Implementation Method 3
Under circumstances in which a seed layer to be formed over the substrate has become thinner and thinner, what is called a terminal effect is liable to occur. The terminal effect is a phenomenon in which, due to high resistance at a central part of the substrate, a film thickness increases at edge parts of the substrate
Data Source
AI summary
Provided is a plate that is arranged between a substrate and an anode in a plating tank. This plate has a plurality of circular pores on each one of at least three reference circles that are concentric with each other and that are different from each other in diameter. The plurality of circular pores include three circular pores that are arranged respectively on adjacent three of the at least three reference circles, and that have centers which are out of alignment with each other on an arbitrary radius on the plate.