Plating Apparatus Dummy Substrate Bubble Removal
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Air bubbles remaining on the ionically resistive element in cup type plating apparatuses can deteriorate the plating quality of substrates, as they are not effectively removed.
Innovation Solution
A plating apparatus and method utilizing a dummy substrate with projecting portions that rotate within the plating solution to create a pressure difference, suctioning air bubbles from the ionically resistive element, ensuring efficient removal while preventing liquid splash and facilitating substrate transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a porous ionically resistive element is arranged in the plating tank to ensure in-plane uniformity of film thickness, then plating uniformity is improved, but air bubbles remain on the ionically resistive element and deteriorate plating quality
Solution Approach 1:
The patent applies preliminary action by introducing a dummy substrate with projecting portions before the actual plating process to remove air bubbles from the ionically resistive element. The dummy substrate is immersed and rotated to suction air bubbles, ensuring the ionically resistive element is bubble-free before substrate plating begins, thus preventing plating defects while maintaining uniformity.
Solution Approach 2:
The patent uses a dummy substrate as an intermediary tool to remove air bubbles. The dummy substrate with its projecting portions acts as a mediator between the plating solution and the ionically resistive element, enabling air bubble removal without directly contacting or damaging the ionically resistive element, thus resolving the contradiction between maintaining uniformity and eliminating harmful bubbles.
2Object-affected harmful factors
If a dummy substrate with projecting portions is used to remove air bubbles, then air bubble removal effectiveness is improved, but device complexity increases
Solution Approach 1:
The patent applies segmentation by dividing the substrate holder into functional zones: a ring structure and a dummy substrate with projecting portions. The projecting portions are segmented features on the dummy substrate that create pressure differences at specific locations, enabling effective air bubble suction while keeping the overall structure modular and manageable.
Solution Approach 2:
The patent uses a dummy substrate as a copy or placeholder instead of using the actual substrate for air bubble removal. This copying approach allows the system to perform the bubble removal function without risking damage to valuable substrates, and the dummy substrate can be easily replaced or reset, simplifying the operational complexity despite the structural additions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively removes air bubbles from the ionically resistive element, improving plating quality and simplifying substrate handling by using a dummy substrate with strategically designed projecting portions to manage pressure and immersion.
Implementation Method 1
air bubbles on a lower surface and inside holes of the ionically resistive element can be suctioned using a pressure difference generated in a peripheral area of the projecting portion of the dummy substrate
Data Source
AI summary
Provided is a technique that allows a removal of air bubbles that remain on an ionically resistive element.A plating apparatus 1000 includes a plating tank 10 configured to accumulate a plating solution Ps and including an ionically resistive element 12 arranged in the plating tank, a substrate holder 30 arranged above the ionically resistive element and configured to hold a dummy substrate Wfx, a rotation mechanism 40 configured to rotate the substrate holder, and an elevating mechanism 50 configured to elevate the substrate holder. At least one projecting portion is disposed on a lower surface of the dummy substrate. The at least one projecting portion 60 projects downward from the lower surface. The substrate holder includes a ring 31 projecting below an outer peripheral edge of the lower surface of the dummy substrate. The projecting portion has a lower surface positioned below a lower surface of the ring. The plating apparatus is configured to cause the rotation mechanism to rotate the substrate holder in a state where the elevating mechanism moves down the substrate holder to allow the projecting portion of the dummy substrate to be positioned above the ionically resistive element and to be immersed in the plating solution of the plating tank.