Cells TRIZ Cases

A flexible planar mesh cathode maintains uniform contact with the separator in modular electrolysis cells.

Electroprocessing solvent dissolves lead materials for high-purity metallic recovery, eliminating smelting pollution and waste.

A multi-compartment cell deposits distinct metals onto a substrate using separate electrolyte reservoirs and controlled current density.

Direct copper-to-carbon contact and reduced cross-sections lower voltage drop and heat flux in Hall-Héroult cells.

A film forming apparatus uses a cation exchange resin partition to separate electrolytic solutions.

Direct bonding of the sealing element to the edge web eliminates gaps that cause parasitic flows and accelerates membrane-electrode assembly aging.

Pressurizing the cathode gas chamber suppresses salt migration from the anode, preventing continuous concentration increases that halt electrolysis.

Segmented power feeding members supply distinct currents to corner and side regions, eliminating terminal effect disparities in film thickness.

Segmented contact points distribute current to prevent resistance increase and non-uniform deposits on low-conductivity substrates.

A sulfuric acid electrolysis process controls electrolyte temperature above 30°C and flow rates at least 1.5 times gas generation to stabilize operation.

A modular microbial electrolysis cell collects hydrogen gas in an internal cavity while treating wastewater.

Liquid-filled gap between ion exchange membrane and cathode gas diffusion electrode reduces ohmic losses while maintaining high faradaic efficiency.

Segmenting the cathode into stacked layers with a conductive membrane prevents gas crossover, enabling high selectivity for multi-carbon molecules.

A membrane-less electrolyzer uses fluid dynamics and insulated flow plates to separate hydrogen and oxygen gases within a single channel.

A membrane-electrode assembly extracts hydrogen from gas mixtures in-line within transport pipes.

Segmented electrocoagulation units adjust dosing and mixing independently, reducing energy waste caused by variable water quality.

Rotating dummy substrate with projecting portions creates pressure gradients to suction air bubbles from ionically resistive elements.

Selective platinum coating on porous transport layers reduces electrical contact resistance, lowering material costs and preventing degradation hot spots.

Iron-based power supply brushes with nickel-coated shafts stabilize electrode roller rotation during electroplating.

Raised members merge the spacer plate with the separator plate to reduce component count and manufacturing cost.

Controlled current density prevents plating voids caused by metal foil projections during via hole formation.

An electrochemical sensor uses a nanoparticle detector zone with electron tunneling to resolve low sensitivity and measurement precision limits.

Electrochemical deposition creates a structured catalyst layer with optimized three-phase zones.

Recycled non-oxidizing gas suppresses oxidation and removes hydrogen sulphide, cutting nitrogen costs.

Feedback and feedforward controls regulate valve openings to reduce differential pressure on the electrolytic membrane, preventing breakage and gas mixing.

A bipolar pulsed power supply uses an output characteristics switching circuit to manage electrode energy delivery.

Ortho-substituted iron porphyrins stabilize active oxidation states to resolve efficiency and selectivity trade-offs in carbon dioxide conversion.

Crystallizing into a BaAl2Si2O8 phase, the material matches thermal expansion coefficients with components while maintaining chemical stability.

A segmented flow field plate supplies reaction gas and electrolyte through separate channels to form a three-phase interface at the catalyst layer.

Unified solid margins on expanded metal sheets enable precise electrical connections and indexing for downstream processing.

Vibrating the substrate holding module reduces electrolyte boundary layer thickness, improving plating uniformity and rate across pattern structures.

A cation-exchange membrane partitions alkaline electrolysis compartments to enable high purity hydrogen production.

A sputtering cathode uses a non-bonded semiconducting target held by compression to maintain stable thermal contact.

A plating cell uses a movable substrate support and edge electrodes to adjust current density profiles across the wafer surface.

A segmented electrochemical cell circulates chromium(II) ions to deposit uniform metallic layers without toxic hexavalent compounds.

Adding hydrazine to water electrolytes lowers energy consumption and eliminates CO2 emissions from traditional steam reforming.

A learning model isolates agitating-motion paddle vibration characteristics from complex operational noise in substrate plating devices.

Monitoring gas-liquid separator temperature and boosting stack resistance allows the system to prevent electrolyte membrane drying during water supplementation.

A substrate holder stock chamber enables continuous production by allowing replacement without breaking vacuum or losing degasification time.

A high aspect ratio sorption bed concentrates nickel ions in regenerant fluid, eliminating low concentration bottlenecks that require additional refining.

Replacing complex analytical equipment, an electrochemical sensor monitors purity in real time at fueling stations to prevent transport contamination.

Electrodeposition process deposits adherent metal layers on stainless steel using methanesulfonic acid baths, eliminating nickel transfer risks.

An elastic conductor with a low expansion peripheral element manages thermal stress to preserve electrical continuity in high temperature electrolysis devices.

Ionized physical vapor deposition process minimizes overhang formation in high aspect ratio vias by balancing sidewall coverage with substrate etching.

Periodic energization maintains rough gold electrode surfaces, preventing false appearance inspection reports caused by plating solution aging.

Sealing substrate edges with a first seal body isolates the edge portion from prewetting liquid, preventing contamination of sealing regions during plating.

Controlling the Zr/Mo ratio in the target maintains chemical resistance while accommodating shorter exposure wavelengths.

Non-perfluorinated surfactants lower dynamic surface tension to minimize gas bubble size, eliminating hazardous mist without explosion-proof installations.

Optimized metal support penetration spaces balance gas supply and structural strength, reducing processing costs while maintaining durability.