Plating Apparatus Vibration for Uniform Metal Deposition
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Solution Overview
Problem
Current electrolyte agitation methods in semiconductor device manufacturing, such as using flow shaping plates or paddles, lead to non-uniform plating rates and quality issues due to uneven additive distribution and electric field disruptions, particularly at high plating rates, making it difficult to achieve both high throughput and uniformity in metal deposition on complex structures.
Innovation Solution
A plating apparatus and method involving a substrate holding module that vibrates horizontally and/or vertically during immersion in the electrolyte, with controlled rotation and vibration frequencies to enhance mass transfer and uniform additive distribution, reducing the electrolyte boundary layer thickness and improving plating uniformity and rate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrolyte flow rate is increased to enhance mass transfer and raise plating rate, then plating rate is improved, but electrolyte flow becomes non-uniform across the substrate causing poor plating uniformity and leveler adhesion issues
Solution Approach 1:
The substrate is rotated during plating at a controlled speed (5-50 rpm) to dynamically change the relative position between the flow port and substrate surface. This rotation ensures that different regions of the substrate experience varying flow rates over time, averaging out the non-uniformity and achieving uniform additive distribution across the entire substrate surface while maintaining high plating rate
Solution Approach 2:
The substrate rotation creates a periodic action where each point on the substrate surface sequentially passes through regions of high and low flow rate during one rotation cycle. This periodic exposure to varying flow conditions ensures uniform additive distribution and prevents leveler adhesion bias, resolving the contradiction between high plating rate and plating uniformity
2Manufacturing precision
If substrate rotation speed is increased to compensate for non-symmetric flow distribution, then plating uniformity is improved, but plating rate decreases due to reduced residence time
Solution Approach 1:
The invention optimizes the rotation speed parameter within a specific range (5-50 rpm) to achieve the best balance between plating uniformity and plating rate. This parameter optimization ensures that the substrate rotates fast enough to distribute additives uniformly but slow enough to maintain adequate residence time for high plating rate, resolving the contradiction between uniformity and productivity
3Productivity
If high plating rate is achieved with higher Cu ions concentration and complex additives, then productivity is improved, but control of film or bump profile becomes more difficult
Solution Approach 1:
The substrate rotation creates dynamic conditions during plating that prevent localized accumulation of leveler and other additives. This dynamic agitation ensures uniform additive distribution even at high plating rates with complex electrolyte formulations, maintaining good bump profile control while achieving high productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vibration and rotation of the substrate holding module ensure uniform distribution of additives, reducing tilt issues in metal pillars or bumps and achieving higher plating rates with improved uniformity across the substrate, addressing the limitations of existing agitation methods.
Implementation Method 1
at least one driving device configured to drive the substrate holding module together with the substrate to horizontally vibrate and/or vertically vibrate during the substrate being immersed into the electrolyte to be plated
Implementation Method 2
a rotating actuator configured to drive the substrate holding module together with the substrate to rotate
Implementation Method 3
The present invention generally relates to semiconductor devices manufacturing, and more particularly relates to plating apparatus and plating method with electrolyte agitation for raising plating rate
Data Source
AI summary
The present invention discloses plating apparatuses and plating methods for metal deposition on a substrate with pattern structures. In an embodiment, a plating apparatus comprises a plating bath configured to accommodate electrolyte, a substrate holding module configured to hold a substrate, and at least one driving device configured to drive the substrate holding module together with the substrate to horizontally vibrate and/or vertically vibrate during the substrate being immersed into the electrolyte to be plated. The present invention can enhance mass transfer during the substrate being plated by vibrating the substrate holding module so as to raise plating rate and uniformly plating on the pattern structures.