Plating Method Edge Sealing for Prewetting Liquid Control

Solution Overview

Problem

In integrated plating apparatuses, prewetting liquids can remain in the edge portions of substrates, obstructing electrical contact and causing plating solutions to enter sealing regions, leading to inefficiencies and contamination.

Innovation Solution

A plating method involving a first sealing step to isolate the edge portion, a prewetting treatment, removal of the seal, and subsequent holding with a substrate holder that includes a second seal to prevent plating solution contact with the edge, ensuring effective substrate handling and plating.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If prewetting treatment is performed before substrate is held by substrate holder, then air inside pattern is replaced with treatment liquid enabling easy plating solution supply, but prewetting liquid remains in edge portion obstructing electrical contact and causing plating solution to enter sealing region

Engineering Contradiction:

Improveplating solution supply efficiencyVSAvoidelectrical contact reliability

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The substrate edge is divided into a sealing region and a non-sealing region. The sealing region is isolated using a sealing member (such as a sealing ring or adhesive tape) applied to the edge portion, preventing prewetting liquid from reaching the electrical contact point while allowing the non-sealing region to be wetted for effective plating solution supply.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate edge are treated differently: the sealing region is protected from prewetting liquid through application of sealing members, while the non-sealing region is allowed to be wetted. This local differentiation enables both reliable electrical contact and effective plating solution supply.

Inventive Principle:

Principle #3Local quality

2Productivity

If prewetting treatment is performed before substrate is held by substrate holder, then plating solution can be easily supplied to interior of pattern, but plating solution enters sealing region causing contamination

Engineering Contradiction:

Improveplating solution supply efficiencyVSAvoidsealing region contamination

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The substrate edge is divided into a sealing region and a non-sealing region. The sealing region is isolated using a sealing member (such as a sealing ring or adhesive tape) applied to the edge portion, preventing prewetting liquid from reaching the electrical contact point while allowing the non-sealing region to be wetted for effective plating solution supply.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A sealing member acts as an intermediary barrier between the prewetting liquid and the sealing region. This sealing member (sealing ring or adhesive tape) allows the plating solution to be supplied effectively to the pattern interior while preventing contamination of the sealing region.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Volume of moving object

If integrated plating apparatus is used with substrate holder and plating tank integrated, then size reduction is achieved, but prewetting liquid management becomes more difficult

Engineering Contradiction:

Improveapparatus sizeVSAvoidprewetting liquid management complexity

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

Different regions of the substrate edge are treated differently: the sealing region is protected from prewetting liquid through application of sealing members, while the non-sealing region is allowed to be wetted. This local differentiation enables both reliable electrical contact and effective plating solution supply.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The sealing member is applied to the substrate edge before the prewetting treatment. This preliminary action ensures that when prewetting liquid is subsequently applied, it cannot penetrate into the sealing region, simplifying the overall liquid management process in the integrated apparatus.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Prevents prewetting liquids from remaining in the edge portions, ensuring reliable electrical contact and preventing plating solution contamination, thereby enhancing the plating process efficiency and quality.

Implementation Method 1

bringing a first seal body into contact with the substrate to seal the edge portion of the substrate

Methodology Applied

Scientific EffectSealing: Physical Containment

Implementation Method 2

holding the substrate with a substrate holder including a second seal body

Methodology Applied

Scientific EffectSealing: Physical Containment

Implementation Method 3

the voltage is applied between the substrate and an anode, thereby precipitating a conductive film on a substrate surface

Methodology Applied

Scientific EffectElectroplating: Electroplating

Data Source

PatentUS11542619B2Plating method

Publication Date: 2023.01.03 EBARA CORP

AI summary

An objective of the present invention is to prevent a prewetting liquid from remaining in an edge portion of a substrate. A plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated. The plating method includes a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting the sealed substrate to a prewetting treatment, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.