Multi-Layer Plating Uniformity via Constant Electrode Area
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Solution Overview
Problem
Forming plating patterns with uniform composition across multiple layers in electronic circuit boards and semiconductor devices is challenging due to the need for adjusting plating-current density in each layer, leading to operational complexity and composition differences.
Innovation Solution
Maintaining a constant electrodeposited area for the plating layer across all layers by using a common plating bath and forming resist frames and auxiliary resist patterns symmetrically, ensuring the total area of these patterns is consistent, thereby keeping the plating-current density constant without adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If plating-current density is adjusted in each layer to accommodate different configuration areas, then plating patterns can be formed on limited portions of the substrate, but operational complexity increases significantly
Solution Approach 1:
The patent changes the parameter of electrode area to remain constant across all layers while varying the plating pattern configurations. This parameter change resolves the contradiction by eliminating the need to adjust plating-current density for different layer configurations, thus reducing operational complexity while maintaining manufacturing precision
Solution Approach 2:
The patent introduces an auxiliary electrode area dimension that compensates for variations in plating pattern configurations. By adding this dimensional element (auxiliary electrode portions), the total electrode area remains constant across layers, allowing different plating pattern shapes without requiring current density adjustments
2Manufacturing precision
If plating-current density is adjusted in each layer, then plating patterns can be formed with different configurations, but composition differences between layers increase
Solution Approach 1:
The patent changes the electrode area parameter to be constant across all layers, which directly stabilizes the plating pattern composition. By maintaining constant total electrode area and using a common plating bath, the composition uniformity is preserved while still allowing different plating pattern configurations through varying resist patterns
3Stability of the object's composition
If constant plating-current density is maintained across layers, then composition uniformity is achieved, but electrode area must be kept constant requiring auxiliary electrodes
Solution Approach 1:
The patent segments the electrode into two functional parts: a variable portion that matches the plating pattern configuration and a fixed auxiliary portion that compensates for area variations. This segmentation allows the total electrode area to remain constant while accommodating different plating pattern shapes, thus achieving composition uniformity without excessive complexity
Solution Approach 2:
The auxiliary electrode portions act as an intermediary element that mediates between the varying plating pattern configurations and the requirement for constant total electrode area. These auxiliary portions compensate for area differences, enabling constant current density and composition uniformity while allowing design flexibility
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for the formation of plating patterns with uniform composition across layers without operational complexity, ensuring consistent properties like magnetic properties by maintaining a constant plating-current density and composition.
Implementation Method 1
a step of forming a plating layer including the plating pattern in each of plurality of layers so that an area of the plating layer electrodeposited is constant in each of the plurality of layers
Data Source
AI summary
A method of plating, which allows compositions of plating patterns of a plurality of layers to be uniform without any operational complexity, is provided. The area of the plating layer electrodeposited including plating patterns is constant in each of the plurality of layers. Accordingly, a value of plating-current density is easily maintained constant without any special operation. Consequently, the plating patterns in each of the plurality of layers is easily formed to have an uniform composition.