Stacked Resist Layers TRIZ Cases
- Double-Faced Film Touch Screen Panel Dead-Space Reduction
A double-faced film touch screen panel distributes sensing electrodes and outer lines on both substrate surfaces to simplify connection structures.
- Semiconductor Package Substrate Cavity Formation Burr Prevention
Electroplated metal protecting layers shield connecting pads during semiconductor package substrate cavity formation.
- Multi-Layer Plating Uniformity via Constant Electrode Area
Constant electrodeposited area stabilizes plating-current density, ensuring uniform composition across multiple layers without operational complexity.