Plating Pod Vortex Agitation for Bubble Removal

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Solution Overview

Problem

Conventional barrel plating apparatuses face issues with increased defects in plating due to the size of entities being plated, where uneven inner drum surfaces can catch entities and exert excessive external forces, and bubbles remaining during the plating process can lead to imperfect plating.

Innovation Solution

A plating apparatus and method utilizing a pod with sieve members that allow plating solution flow, creating a liquid flow to lift and remove bubbles, with an anode outside and cathode inside the pod to manage electric current and agitation without excessive force, and a rotating mechanism to generate a vortex flow for effective agitation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the inner wall of the drum is provided with unevenness to agitate entities, then agitation effectiveness is improved, but entities may be caught by the unevenness and excessive external force is exerted on entities

Engineering Contradiction:

Improveagitation effectivenessVSAvoidexcessive external force on entities

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a liquid flow as an intermediary to perform agitation. Instead of direct mechanical contact between the drum unevenness and entities, the liquid flow mediates the agitation process by lifting entities and removing bubbles, achieving effective agitation without excessive external force on the entities.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes hydraulic principles by creating a liquid flow within the drum to achieve agitation. The liquid flow dynamics lift entities and remove bubbles through fluid motion rather than direct mechanical action, reducing harmful forces while maintaining agitation effectiveness.

Inventive Principle:

Principle #29Pneumatics and hydraulics

2Manufacturing precision

If bubbles remain around entities during plating, then plating quality deteriorates, but conventional agitation methods exert excessive force on entities

Engineering Contradiction:

Improveplating qualityVSAvoidexcessive external force on entities

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The liquid flow serves as an intermediary that specifically targets bubble removal without directly contacting entities with excessive force. The flow dynamics are designed to lift entities slightly and wash away bubbles, improving plating quality while minimizing mechanical stress on the entities.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Productivity

If conventional agitation methods are used, then solution agitation is achieved, but entities are subjected to excessive external force causing defects

Engineering Contradiction:

Improvesolution agitationVSAvoiddefect reduction

Core Design Contradiction:

ProductivityVSReliability

Solution Approach 1:

The patent replaces direct mechanical agitation (drum unevenness contacting entities) with a fluid-based agitation system. The liquid flow performs the agitation function through hydrodynamic forces, eliminating the need for mechanical contact that causes excessive force and defects on entities.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces defects in plating by effectively removing bubbles and agitating the solution without exerting excessive force on entities, ensuring better contact with the cathode and improved plating efficiency.

Implementation Method 1

the liquid flow lifts the entity up and removes bubbles existing near the entity

Methodology Applied

Scientific EffectBuoyancy: Archimedes' Principle (Buoyancy)

Implementation Method 2

a vortex flow occurs around the axis to lift the entity up

Methodology Applied

Scientific EffectVortex flow: Vortex Ring

Implementation Method 3

the pod is rotated around its axis along the direction of outflow of the plating solution, a vortex flow occurs around the axis to lift the entity up

Methodology Applied

Scientific EffectCentrifugal force: Centrifugal Force

Implementation Method 4

an anode is disposed in the plating bath and outside the pod and a cathode is disposed in the pod. Since the cathode is disposed in the pod while the anode is disposed outside the pod, an electric current is allowed to flow while the entity in the pod is kept in contact with the cathode only

Methodology Applied

Scientific EffectElectroplating: Electroplating

Implementation Method 5

an electric current is allowed to flow while the entity in the pod is kept in contact with the cathode only

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Data Source

PatentUS7811440B2Plating apparatus and plating method

Publication Date: 2010.10.12 TDK CORP

AI summary

A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes.