Electrolytic Plating Apparatus Seal and Contact Member Segmentation
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Solution Overview
Problem
Existing electrolytic plating apparatuses face challenges in separately controlling the pressing forces of seal and contact members, which can lead to substrate damage or inadequate contact, particularly when dealing with varied materials and film thicknesses, and the integrally molded structure restricts placement and pressure adjustment.
Innovation Solution
The apparatus includes a separate seal member and contact member, where the seal member is disposed at the peripheral edge of the substrate to prevent plating liquid intrusion, and the contact member is electrically connected to the substrate, allowing independent adjustment of their positions, heights, and pressing forces to optimize contact and prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the seal member and contact member are integrally molded, then the structure is simplified, but the pressing forces of the seal member and contact member cannot be separately controlled
Solution Approach 1:
The seal member and contact member are divided into separate components rather than being integrally molded. The seal member is positioned at the peripheral edge portion of the substrate while the contact member is separated and positioned at a different location, allowing independent control of their pressing forces through separate mounting mechanisms
2Reliability
If the pressing force of the seal member is increased to improve sealing, then plating liquid intrusion is prevented, but the wafer may be stuck to the seal member and broken
Solution Approach 1:
The pressing force is localized and optimized for each component's function. The seal member applies sufficient pressure at the peripheral edge to prevent plating liquid intrusion, while the contact member applies appropriate pressure for electrical contact without excessive force that could damage the wafer. Each member's pressing force is independently adjustable
3Ease of operation
If the contact member is positioned to contact the substrate edge, then contact area is reduced, but electrical connection is achieved
Solution Approach 1:
The contact member is positioned in a different spatial location than the seal member, separated from the peripheral edge area. This allows the contact member to engage with the substrate at an optimal position for electrical connection while the seal member handles the sealing function at the edge, effectively using spatial separation to resolve the conflict between contact area and connection reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables precise control over the sealing and electrical contact, preventing substrate damage and ensuring consistent plating performance across different materials and configurations, while allowing for flexible placement of the seal and contact members.
Implementation Method 1
a seal member that is disposed at a peripheral edge portion of a processing target surface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank
Implementation Method 2
a contact member that is separated from the seal member and is electrically connected to the processing target surface
Data Source
AI summary
An electrolytic plating apparatus includes a plating tank that is filled with plating liquid; a moving mechanism configured to vertically move a processing target substrate in a direction normal to a surface of the plating liquid; a seal member that is disposed at a peripheral edge portion of a processing target surface of a processing target substrate and is configured to seal the plating liquid to a center side of the processing target surface when the processing target substrate is immersed in the plating tank; and a contact member that is separated from the seal member and is electrically connected to the processing target surface.