Pogo Block Positioning Pin Alignment for Thermal Deviation
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Solution Overview
Problem
In semiconductor device manufacturing, positional deviation between a pogo frame and a pogo block occurs due to differences in thermal expansion, leading to misalignment of pogo pins and terminals, which is challenging to manage as devices miniaturize and the number of pins increases.
Innovation Solution
An intermediate connection member is designed with a pogo block and pogo frame configuration, where the pogo block includes a positioning pin that inserts into a corresponding positioning hole in the pogo frame, allowing for precise alignment and reducing thermal expansion-induced misalignment by using a NiFe alloy for the frame and resin for the block.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pogo block is inserted into a pogo frame without a positioning mechanism, then the assembly is simple, but positional deviation occurs due to thermal expansion differences
Solution Approach 1:
A positioning pin is introduced as an intermediary element between the pogo block and pogo frame. The positioning pin fits into a positioning hole in the pogo frame, serving as a mediator that prevents positional deviation caused by thermal expansion differences between the resin pogo block and metal pogo frame, while maintaining simple assembly through a straightforward insert-fixture process
2Quantity of substance
If the number of pogo pins is increased to support device miniaturization, then more electrical connections are possible, but thermal expansion-induced misalignment becomes more challenging to manage
Solution Approach 1:
The material parameters of the pogo block are changed by using resin with specific thermal expansion characteristics that complement the metal pogo frame. Additionally, the positioning pin mechanism changes the geometric parameters of the assembly, providing fixed reference points that maintain alignment accuracy even as the number of pins increases for device miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses positional deviation between the pogo frame and pogo block, ensuring accurate electrical connection and maintaining alignment even under varying temperatures, thereby supporting the increasing pin count and miniaturization of semiconductor devices.
Implementation Method 1
positional deviation between a pogo frame and a pogo block due to a difference in thermal expansion therebetween
Data Source
AI summary
There is provided an intermediate connection member which is provided between a first member having a plurality of first terminals and a second member having a plurality of second terminals and electrically connects the plurality of first terminals and the plurality of second terminals, respectively, the intermediate connection member including: a pogo block including a main body and a plurality of pogo pins provided in the main body, the pogo block configured to connect the plurality of first terminals and the plurality of second terminals, respectively; and a pogo frame having an insertion hole into which the pogo block is inserted, wherein the pogo block has a positioning pin, and the pogo frame has a positioning hole into which the positioning pin is inserted, and wherein the pogo block is positioned with respect to the pogo frame when the positioning pin is inserted into the positioning hole.