Polarized LED Encapsulation for Durable 3D Display Modules
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Solution Overview
Problem
Current stereoscopic display systems fail to provide a wide range of 3D viewing experiences beyond traditional movie theater environments, such as billboards and large public displays, due to limitations in technology and viewer discomfort from color-coded lenses.
Innovation Solution
The development of polarized light emitting semiconductor packages, where a bonding solution is used to encapsulate light emitting elements with polarizing elements, creating alternating rows of left and right polarized packages for a checkerboard pattern, enabling a 3D viewing experience on various devices using appropriate eyewear.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If color-coded lenses are used to segregate viewing channels, then stereoscopic viewing is achieved, but viewer comfort deteriorates causing headaches
Solution Approach 1:
The patent transitions from color-coded lenses (anaglyph method) to polarized light filtering. Instead of using different colors (red/cyan or red/green lenses), the invention uses polarizing filters with specific orientation angles (0° and 90°) to separate left and right eye views. This eliminates the chromatic aberration and viewer discomfort associated with color segregation while maintaining effective stereoscopic separation.
Solution Approach 2:
The invention changes the fundamental parameter used for view segregation from color wavelength to light polarization angle. By orienting polarizing filters at perpendicular angles (0° and 90°), the system achieves reliable stereoscopic separation without the harmful effects of color-coded lenses, thereby improving viewer comfort while maintaining 3D viewing capability.
2Ease of manufacture
If polarizing elements are mounted directly on light emitting elements, then manufacturing is simplified, but durability deteriorates due to fragility
Solution Approach 1:
The patent integrates the polarizing element directly into the semiconductor package structure during the encapsulation process, rather than mounting it separately on the light emitting element. The polarizing film is incorporated into the bonding solution or encapsulant material, creating a unified, durable structure that maintains manufacturing simplicity while significantly improving mechanical strength and fragility resistance.
Solution Approach 2:
The invention creates a composite structure where the polarizing element is combined with the encapsulant material or bonding solution to form a single integrated package. This composite approach embeds the fragile polarizing film within a protective matrix, eliminating the need for separate mounting while enhancing overall package durability and mechanical strength.
3Reliability
If encapsulation is performed to protect components, then reliability improves, but manufacturing complexity increases due to additional processing steps
Solution Approach 1:
The patent combines the encapsulation function with the polarizing element integration into a single manufacturing step. The bonding solution or encapsulant material serves dual purposes: protecting the light emitting element and incorporating the polarizing film simultaneously. This eliminates separate encapsulation and polarizer mounting steps, reducing manufacturing complexity while maintaining component protection and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution allows for realistic 3D viewing on larger displays like stadium screens and outdoor events, providing a modular and durable solution that can switch between 2D and 3D content, enhancing viewer comfort and expanding 3D viewing capabilities beyond traditional environments.
Implementation Method 1
A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package
Data Source
AI summary
The present invention provides systems, and methods for manufacturing polarized light emitting semiconductor packages, comprising the disposition of a first bonding solution about (a) a first light emitting element and (b) a first polarizing element, wherein the first polarizing element transmits linearly polarized light in a first directionality. A first energy is applied to polymerize the first bonding solution, thereby encapsulating the first polarizing element and a first light emitting element in a first semiconductor package. A second bonding solution is disposed about (a) a second light emitting element and (b) a second polarizing element, wherein the second polarizing element transmits polarized light in a second directionality different from the first directionality, and a second energy is applied to polymerize the second bonding solution, thereby encapsulating the second polarizing element and the second light emitting element in a second semiconductor package.