Polishing Apparatus Data Sharing for Substrate Thickness Detection
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Solution Overview
Problem
In semiconductor device manufacturing, the CMP process faces challenges in efficiently detecting substrate thickness during continuous polishing, leading to increased time and difficulty in producing additional metal layers due to variations in surface morphology.
Innovation Solution
A substrate polishing system and method that involves multiple polishing apparatuses sharing data to detect substrate thickness, with each apparatus analyzing signals to determine real-time thickness and polishing endpoints, allowing for interpolation of data from previous processes to reduce detection time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple polishing apparatuses perform continuous substrate polishing, then productivity is improved, but the time required to detect substrate thickness increases
Solution Approach 1:
The system performs preliminary thickness detection at the first polishing apparatus before the substrate enters subsequent polishing apparatuses. The detected thickness data is then transferred and utilized by downstream apparatuses, eliminating the need for each apparatus to perform independent full detection sequences and reducing overall detection time in continuous polishing operations.
Solution Approach 2:
The system implements a feedback mechanism where thickness detection results from the first polishing apparatus are transmitted to subsequent polishing apparatuses. This feedback loop allows downstream apparatuses to utilize previously acquired thickness data, adjusting their own detection and polishing parameters accordingly, thereby reducing redundant detection time while maintaining productivity.
2Manufacturing precision
If substrate thickness is detected in real-time during continuous polishing, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The polishing system is segmented into multiple independent apparatuses, each equipped with its own thickness detection module. Rather than requiring a single complex centralized detection system, each apparatus performs local real-time detection independently, simplifying the overall system architecture while maintaining manufacturing precision through distributed measurement capabilities.
Solution Approach 2:
Each polishing apparatus is designed with multi-functionality, serving both as a polishing unit and a thickness detection unit. This universal design allows each apparatus to independently perform both polishing and real-time thickness measurement, reducing the need for separate specialized detection equipment and simplifying the overall system complexity while maintaining precision.
Data Source
AI summary
The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.