Polishing Apparatus With Barrier-Separated Thermal Fluid and Slurry

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

The challenge in semiconductor polishing processes is the uneven polishing speeds of multiple films on a wafer, leading to issues like erosion or dishing, due to variations in temperature and mixing of temperature-control fluids with slurry solutions, which degrade polishing performance.

Innovation Solution

A polishing process apparatus with a nozzle barrier to separate temperature-control fluid from slurry solution on the polishing pad, combined with a controller to maintain the platen and polishing pad temperatures within specific ranges, ensuring efficient temperature control and preventing dilution of the slurry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If temperature-control fluid is discharged to the polishing pad without separation, then temperature control is achieved, but slurry solution is diluted which degrades polishing performance

Engineering Contradiction:

Improvepolishing pad temperatureVSAvoidpolishing uniformity

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The polishing pad surface is divided into distinct zones using a barrier element. The temperature-control fluid is confined to a first region while the slurry solution is applied to a second region, preventing mixing and maintaining both thermal control and polishing performance.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The harmful mixing effect is eliminated by extracting the temperature-control fluid from the slurry application area. A barrier structure removes the fluid from the polishing surface after temperature control is achieved, preventing dilution of the slurry.

Inventive Principle:

Principle #2Taking out (Extraction)

2Productivity

If multiple films are polished simultaneously, then productivity is improved, but uneven polishing speeds cause erosion or dishing

Engineering Contradiction:

Improvepolishing throughputVSAvoidfilm thickness uniformity

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The temperature of the polishing pad is controlled within a specific range (e.g., 15-30°C) to optimize polishing conditions. By maintaining consistent temperature, the polishing speeds of multiple films are equalized, preventing erosion and dishing while enabling simultaneous processing.

Inventive Principle:

Principle #35Parameter changes

3Temperature

If temperature-control fluid supply is increased, then temperature control efficiency is improved, but slurry solution dilution increases

Engineering Contradiction:

Improvepolishing pad temperature control efficiencyVSAvoidslurry solution concentration

Core Design Contradiction:

TemperatureVSQuantity of substance

Solution Approach 1:

A barrier element acts as an intermediary between the temperature-control fluid and slurry solution. This barrier allows thermal energy transfer to the polishing pad while physically preventing the mixing of fluids, enabling efficient temperature control without slurry dilution.

Inventive Principle:

Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach maintains consistent polishing speeds across films, preventing erosion and dishing, thereby enhancing the efficiency and speed of the polishing process.

Implementation Method 1

a first nozzle configured to supply fluid to an upper surface of the polishing pad

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

at least one nozzle configured to discharge temperature-control fluid to an upper surface of the polishing pad

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

a barrier configured to separate temperature-control fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle on an upper surface of the polishing pad

Methodology Applied

Scientific EffectPhysical barrier separation: Physical Containment

Implementation Method 4

maintain a temperature of the platen to be within a platen target temperature range by controlling the platen

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250249545A1Polishing process apparatus

Publication Date: 2025.08.07 SAMSUNG ELECTRONICS CO LTD

AI summary

A polishing process apparatus includes a carrier configured to hold a polishing target; a platen disposed below the carrier; a polishing pad disposed below the platen; a nozzle system including at least one nozzle configured to discharge temperature-control fluid to an upper surface of the polishing pad, an additional nozzle configured to discharge slurry solution to an upper surface of the polishing pad, and a barrier configured to separate temperature-control fluid discharged from the at least one nozzle from slurry solution discharged from the additional nozzle on an upper surface of the polishing pad; a temperature sensor configured to measure a temperature of the polishing pad; and a controller configured to control the platen, the at least one nozzle, the additional nozzle, the barrier, and the temperature sensor. The controller is configured to maintain a temperature of the platen to be within a platen target temperature range by controlling the platen, and to maintain a temperature of the polishing pad to be within a process target temperature range by controlling at least one of a supply amount and a temperature of the temperature-control fluid discharged from the at least one nozzle.