Polishing Device Cover Vibration Isolation via Elastic Rod
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Solution Overview
Problem
Polishing devices in semiconductor processing face issues with fatigue failure of covers and other members due to vibrations from rotary joints, particularly when covers are made of resin and rigidly fixed, leading to potential leaks and damage.
Innovation Solution
The use of elastic members and rod-shaped supports to mitigate stress on covers by supporting them via elastic elements, reducing the risk of fatigue failure and leaks, while maintaining positional stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If the cover is rigidly screw-fixed to the frame of the polishing unit, then the cover can effectively contain liquid and prevent scattering, but the cover may receive repeated stress due to vibration of the rotary joint and suffer fatigue failure in a relatively short period
Solution Approach 1:
The patent introduces a vibration-absorbing member as an intermediary between the cover and the frame. This member absorbs vibrations from the rotary joint before they reach the cover, preventing repeated stress accumulation while maintaining the cover's liquid containment function. The intermediary element decouples the rigid connection that causes fatigue while preserving the essential sealing function.
Solution Approach 2:
The vibration-absorbing member provides beforehand cushioning by being pre-installed between the cover and frame to absorb upcoming vibrations. This preventive measure cushions the cover against repeated vibrational stress before fatigue failure can occur, while still allowing the cover to effectively contain liquid during normal operation.
2Object-affected harmful factors
If the cover is made of resin material, then it can provide effective containment, but it is more susceptible to fatigue failure due to repeated vibration stress
Solution Approach 1:
The vibration-absorbing member serves as a mediator that protects the resin cover from direct exposure to vibrational stress. By placing this intermediate element between the vibration source and the resin cover, the cover maintains its liquid containment properties while the intermediary absorbs the harmful vibrational effects that would otherwise cause fatigue failure in the resin material.
Solution Approach 2:
The patent changes the mechanical parameters of the connection system by introducing a vibration-absorbing member with different material properties than the resin cover. This parameter change allows the system to maintain liquid containment while altering the stress transmission characteristics to protect the resin cover from fatigue.
3Ease of operation
If members are attached near the vibration source, then they can provide necessary support and containment, but they receive repeated stress due to vibration and may suffer fatigue failure
Solution Approach 1:
The vibration-absorbing member acts as an intermediary that enables other members to be attached near the vibration source while protecting them from fatigue. This intermediary element absorbs the vibrational stress, allowing support and containment members to maintain their necessary functions without suffering from repeated vibration-induced stress.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses fatigue failure and liquid scattering, ensuring reliable operation of polishing devices by absorbing vibrations and preventing cover damage.
Implementation Method 1
a first elastic member, the first rod-shaped member is inserted into the first hole, and the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole
Data Source
AI summary
A semiconductor processing device according to the disclosure is a semiconductor processing device that includes a first rod-shaped member, a first member to which the first rod-shaped member is fixed, a second member in which a first hole is formed, and a first elastic member. The first rod-shaped member is inserted into the first hole, and the first elastic member is configured to surround an outer circumferential surface of the first rod-shaped member inside the first hole.