Polishing Device with Elastic Fixing and Correction Rings
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Solution Overview
Problem
Conventional delayering processes in semiconductor manufacturing are inefficient due to manual operation variability, prolonged processing time, and difficulty in precisely controlling polishing thickness and surface flatness, especially when monitoring the cross-section of the polished object.
Innovation Solution
A polishing device with a stage that moves along the X-axis and Y-axis, a rotatable holder with a seating groove and elastic fixing unit, and a grinder unit with a felt or fabric polishing pad, supported by horizontal correction rings to ensure precise and efficient polishing by allowing easy identification of the polishing area and maintaining surface flatness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a conventional polishing device for semiconductor manufacturing is used to polish the bottom surface of the object, then the polishing operation can be performed, but the polishing area cannot be easily identified and the cross-section cannot be monitored during polishing, significantly reducing work efficiency
Solution Approach 1:
The holder is segmented into multiple functional components: a rotating plate with a seating groove for positioning the object, elastic pressing units for fixing the object, and horizontal correction rings for maintaining polishing precision. This segmentation allows each component to perform its specific function independently, enabling easy identification of the polishing area and monitoring of the cross-section during the polishing process.
2Productivity
If manual grinding operation is performed by workers using a grinding tool while the object is fixed using a separate jig, then the polishing work can be performed, but the results vary significantly depending on the operator's skill level and the polishing work takes a considerable amount of time
Solution Approach 1:
The polishing device is designed to perform the polishing operation automatically without requiring manual intervention. The holder automatically positions the object using the seating groove and elastic pressing units, the polishing plate rotates to polish the bottom surface, and the system can pause for cross-section monitoring. This automation eliminates dependence on operator skill level and significantly reduces polishing time while maintaining consistent results.
3Measurement precision
If the polishing operation is stopped and the object is pulled out from the device to monitor the cross-section, then the quality check can be performed, but the work efficiency is significantly reduced and process time increases
Solution Approach 1:
The polishing operation is designed to be continuous, with the ability to pause at convenient intervals for cross-section monitoring. The object remains in the holder throughout the process, and the polishing plate continues to rotate. When monitoring is needed, only the polishing action is temporarily paused while the object stays in position, eliminating the time loss associated with removing and repositioning the object. This maintains continuous useful action while enabling quality monitoring.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves work efficiency and reduces processing time by enabling precise control over polishing thickness and surface flatness, allowing for efficient delayering operations with improved monitoring capabilities.
Implementation Method 1
a fixing unit installed on one side of an inner wall of the rotating plate having the seating groove so as to fix the object by elastically pressing a side of the object when the object is seated in the seating groove
Implementation Method 2
a tool unit made of a felt material or a fabric material, which is rotatably installed at a lower portion of the main body and grinds the object while rotating in contact with the object
Data Source
AI summary
A polishing device for delayering includes: a stage which is installed to move along the X-axis and the Y-axis, and is rotatable about its own axis; a holder installed above the stage and supporting an object mounted on the upper surface thereof; and a grinder unit installed to be movable above the holder and having a polishing pad on one surface thereof corresponding to the object. The holder includes a rotating plate, a fixing unit installed on one side of an inner wall of the rotating plate, and horizontal correction rings that protrudes upward from an upper surface of the rotating plate.