Lapping Tools TRIZ Cases
- Polishing Head Cap Assembly to Prevent Epoxy Joint Failure
Removable fasteners, a sealed chamber, and a non-metallic band replace epoxy joints to prevent leaks, contamination, and wafer damage.
- CMP Slurry Dispense Nozzle With Isolated Valve for Uniform Flow
A non-metallic CMP slurry nozzle uses a valve-isolated actuator and simple flow path to improve distribution uniformity and reduce waste.
- CMP Pad Groove Structure for Monitor Window Rate Uniformity
Grooves around CMP pad monitor windows offset slurry brush-rate jumps, improving polishing uniformity while enabling real-time profile monitoring.
- Magnetic CMP Retainer Ring for Fast Lower Ring Replacement
A magnetic upper ring and detachable lower ring speed CMP retainer ring replacement while preserving alignment and protecting the polishing head.
- Melamine Hollow Particle Structure for Large, Dispersible Fillers
Segmented melamine-resin hollow particles solve the tradeoff between heat and solvent resistance, large particle size, and good dispersibility.
- Viscoelastic Polishing Pad for Edge Sagging and Step Elimination
Controlled viscoelasticity across frequencies helps a polishing pad limit edge sagging while improving step elimination and polishing uniformity.