CMP Polishing Pad Continuous Protrusions Slurry Retention

Solution Overview

Problem

Conventional CMP polishing pads with concentric circular groove patterns suffer from poor slurry distribution and retention, leading to inefficient material removal and planarization in semiconductor fabrication.

Innovation Solution

Polishing pads with continuous cylindrical or modified-quadrilateral protrusions are used, which provide improved slurry retention and uniform polishing across the substrate, enhancing material removal and planarization by maintaining consistent localized polishing characteristics and reducing slurry loss.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If conventional CMP polishing pads with concentric circular groove patterns are used, then the polishing pad structure is simple and easy to manufacture, but slurry distribution and retention are poor leading to inefficient material removal

Engineering Contradiction:

Improvematerial removal efficiencyVSAvoidpolishing pad structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The polishing pad surface is segmented into multiple discrete protrusion elements distributed across the polishing surface. Each protrusion acts as an independent slurry retention zone, creating numerous small reservoirs that collectively improve slurry distribution and retention throughout the polishing process, thereby enhancing material removal efficiency without requiring complex overall pad structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The polishing pad features localized protrusions with specific geometric characteristics (height, width, spacing) that create regions of enhanced slurry retention. These localized features provide differentiated functionality across the pad surface, with protrusions strategically positioned to maintain optimal slurry contact at the polishing interface, improving material removal efficiency through targeted local enhancement rather than uniform complexity

Inventive Principle:

Principle #3Local quality

2Loss of substance

If conventional CMP polishing pads with concentric circular groove patterns are used, then the polishing pad structure is simple, but slurry retention is poor leading to slurry loss

Engineering Contradiction:

Improveslurry lossVSAvoidpolishing pad structure complexity

Core Design Contradiction:

Loss of substanceVSDevice complexity

Solution Approach 1:

The polishing pad surface is segmented into multiple discrete protrusion elements distributed across the polishing surface. Each protrusion acts as an independent slurry retention zone, creating numerous small reservoirs that collectively improve slurry distribution and retention throughout the polishing process, thereby enhancing material removal efficiency without requiring complex overall pad structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The polishing pad features localized protrusions with specific geometric characteristics (height, width, spacing) that create regions of enhanced slurry retention. These localized features provide differentiated functionality across the pad surface, with protrusions strategically positioned to maintain optimal slurry contact at the polishing interface, improving material removal efficiency through targeted local enhancement rather than uniform complexity

Inventive Principle:

Principle #3Local quality

3Manufacturing precision

If polishing pads with continuous protrusions are used, then slurry retention and uniform polishing are improved, but the polishing pad manufacturing becomes more complex

Engineering Contradiction:

Improveuniform polishing qualityVSAvoidpolishing pad manufacturing ease

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The polishing pad surface is segmented into multiple discrete protrusion elements distributed across the polishing surface. Each protrusion acts as an independent slurry retention zone, creating numerous small reservoirs that collectively improve slurry distribution and retention throughout the polishing process, thereby enhancing material removal efficiency without requiring complex overall pad structure

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protrusions are designed with specific geometric parameters (height, width, spacing, shape) that can be optimized to achieve desired polishing performance. By carefully selecting these parameters, the pad achieves consistent localized polishing characteristics and improved slurry retention while maintaining manufacturability through standardized feature dimensions that can be produced using conventional molding or machining techniques

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS10293459B2Polishing pad having polishing surface with continuous protrusions

Publication Date: 2019.05.21 CMC MATERIALS INC

AI summary

Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.