Polishing Device End Point Condition Setter
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Solution Overview
Problem
Conventional end point detection in chemical-mechanical polishing for semiconductor manufacturing is inaccurate due to fixed end point conditions, leading to excessive or deficient polishing, as these conditions do not account for variations in polishing device and target state.
Innovation Solution
A polishing device with an end point condition setter that optimizes end point conditions using device and target information, such as cumulative treated targets, film thickness, and surface state, to adjust thresholds and maximum polishing times, enhancing detection accuracy by differentiating drive current waveforms.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If fixed end point conditions are used in conventional polishing, then the polishing process is simple to control, but the detection accuracy is insufficient leading to excessive or deficient polishing
Solution Approach 1:
The end point condition setting is changed from a static fixed value to a dynamic adaptive system. The polishing control system continuously monitors polishing state and automatically adjusts end point conditions based on real-time feedback, allowing the system to adapt to variations in polishing device state and target material properties, thereby improving detection accuracy without requiring complex manual intervention
Solution Approach 2:
The system implements a feedback mechanism where polishing state information is continuously monitored and fed back to the end point condition setter. This feedback loop enables automatic optimization of end point conditions based on actual polishing performance, resolving the contradiction by using the feedback information to dynamically adjust control parameters and improve detection accuracy while maintaining automated control
2Manufacturing precision
If fixed end point conditions are used, then the polishing control is straightforward, but excessive or deficient polishing occurs due to insufficient adaptation to device state variations
Solution Approach 1:
The system dynamically changes end point condition parameters based on polishing device state and target material characteristics. By automatically adjusting these parameters in response to detected variations, the system achieves both high manufacturing precision and adaptability to different polishing scenarios, resolving the contradiction between precision and adaptability
Solution Approach 2:
The polishing control system performs self-adjustment by automatically optimizing end point conditions based on monitored polishing state information. This self-service capability enables the system to adapt to device state variations and maintain high polishing precision without requiring external intervention, simultaneously achieving precision and adaptability
Data Source
AI summary
According to an embodiment, a polishing device which polishes a surface of a polishing target, includes a sensor, an end point detector, and an end point condition setter. The sensor senses a characteristic value correlated with a state of the surface during polishing. The end point detector detects that the characteristic value or a polishing time satisfies an end point condition corresponding to an end point of the polishing. The end point condition setter sets the end point condition in accordance with at least one of device information about the polishing device and polishing target information about the polishing target, and outputs the set end point condition to the end point detector.