Polishing Head With Local Pressure And Temperature Control

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Solution Overview

Problem

Existing chemical mechanical polishing (CMP) technologies face challenges in achieving uniform polishing due to limitations in local pressure control and indirect temperature control, which can result in uneven substrate flatness, prolonged temperature control times, and potential damage to metal layers.

Innovation Solution

A polishing head with a substrate carrier featuring a flexible membrane with pressurizing chambers and integrated temperature and pressure elements, allowing for local control of pressure and temperature directly on the substrate.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If a flexible membrane with ring-shaped zones is used to control pressure, then pressure control is achieved, but local pressure control is not possible resulting in uneven substrate flatness

Engineering Contradiction:

Improvepressure controlVSAvoidsubstrate flatness

Core Design Contradiction:

Stress or pressureVSManufacturing precision

Solution Approach 1:

The flexible membrane is divided into multiple independent pressurizing chambers (first, second, third chambers) that can be controlled separately. Each chamber can apply pressure independently to different regions of the substrate, enabling local pressure control and improving substrate flatness uniformity across the polishing surface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the flexible membrane are equipped with different numbers and configurations of pressurizing chambers to provide locally optimized pressure control. The first pressurizing chamber has a different structure compared to the second and third chambers, allowing tailored pressure distribution for different zones of the substrate.

Inventive Principle:

Principle #3Local quality

2Temperature

If indirect temperature control through polishing pad is used, then temperature control is achieved, but considerable time is consumed causing slurry to solidify and generate defects

Engineering Contradiction:

Improvepolishing pad temperatureVSAvoidtemperature control time

Core Design Contradiction:

TemperatureVSLoss of time

Solution Approach 1:

Temperature control elements are extracted from the indirect polishing pad method and integrated directly into the flexible membrane structure. Temperature control chambers are formed within the flexible membrane, allowing direct thermal contact with the substrate and enabling rapid temperature adjustment without waiting for heat transfer through the polishing pad.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The flexible membrane with integrated temperature control chambers acts as an intermediary between the temperature control system and the substrate. This intermediary structure provides direct thermal coupling, enabling efficient heat transfer and rapid temperature control compared to indirect methods.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Temperature

If indirect temperature control is used, then temperature adjustment is possible, but direct cooling is not possible causing unintended damage to metal layer

Engineering Contradiction:

Improvesubstrate temperatureVSAvoidmetal layer damage

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

Direct cooling capability is extracted and integrated into the flexible membrane through dedicated temperature control chambers. These chambers can actively remove heat from the substrate, providing direct cooling functionality that prevents thermal damage to sensitive metal layers during polishing operations.

Inventive Principle:

Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution improves polishing uniformity by enabling precise local pressure control, reduces defects by shortening heating and cooling times, and prevents unintentional damage to metal layers through direct temperature management.

Implementation Method 1

a plurality of pressurizing chambers divided along a radial direction and about a central axis by the plurality of vertical thin films

Methodology Applied

Scientific EffectFluid pressure: Pressure Increase

Implementation Method 2

a plurality of temperature elements in the main thin film and under the plurality of pressurizing chambers, the plurality of temperature elements configured to apply local heat to the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20250135600A1Polishing head and polishing carrier apparatus having the same

Publication Date: 2025.05.01 SAMSUNG ELECTRONICS CO LTD

AI summary

A polishing head may include a substrate carrier detachably secured to a driving shaft and to pressurize and rotate a substrate, the substrate carrier includes a flexible membrane, wherein the flexible membrane includes a main thin film having a first surface to be in contact with the substrate and a second surface opposite to the first surface and a plurality of vertical thin films extending from the main thin film in a vertical direction to define a plurality of pressurizing chambers that are divided along a radial direction about a central axis; a plurality of temperature elements disposed under the plurality of pressurizing chambers in the main thin film and configured to apply local heat to the substrate; and a plurality of pressure elements respectively disposed on the plurality of temperature elements in the main thin film and configured to apply local pressure to the main thin film.