Intermittent Polishing Liquid Supply for CMP
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Solution Overview
Problem
The chemical mechanical polishing (CMP) process faces challenges in efficiently managing the supply of polishing liquids, leading to wastage and environmental pollution, while also requiring careful evaluation to ensure stable and uniform planarization for high-quality alignment accuracy in VLSI/ULSI manufacturing.
Innovation Solution
A method of supplying polishing liquid intermittently, with specific periods of supply and cessation, allowing for reduced consumption and wastage, and adjustable based on real-time monitoring and process requirements, thereby optimizing the CMP process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If polishing liquid is supplied continuously during CMP process, then stable polishing performance is maintained, but polishing liquid consumption and wastage increase
Solution Approach 1:
The patent applies periodic action by intermittently supplying polishing liquid during the CMP process. The supply is activated during specific phases (e.g., when the polishing pad surface requires replenishment) and deactivated during other phases, creating a periodic on-off pattern that reduces overall consumption while maintaining polishing effectiveness.
Solution Approach 2:
The patent changes the parameter of polishing liquid supply from continuous to intermittent mode. By adjusting the timing and duration of supply cycles based on process requirements, the system optimizes the balance between maintaining stable polishing performance and reducing liquid consumption.
2Loss of substance
If polishing liquid supply is interrupted to reduce consumption, then polishing liquid wastage decreases, but polishing uniformity may be affected
Solution Approach 1:
The patent implements feedback control by monitoring polishing process parameters and adjusting the polishing liquid supply timing accordingly. The intermittent supply pattern is optimized based on observed polishing performance, ensuring that liquid is supplied at critical moments to maintain uniformity while minimizing overall consumption.
Solution Approach 2:
The patent introduces dynamic adjustment of polishing liquid supply timing and duration. Rather than using a fixed intermittent pattern, the system adapts the supply schedule based on real-time process conditions, allowing optimization of both consumption reduction and polishing uniformity maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach minimizes polishing liquid wastage, reduces production costs, and maintains stable and uniform polishing performance, achieving comparable or better results in material removal rates and defect counts while lowering average polishing costs.
Implementation Method 1
CMP employs similar concepts of the grinding wheels in conjunction with chemical substances to planarize and flatten the uneven surfaces
Implementation Method 2
CMP employs similar concepts of the grinding wheels in conjunction with chemical substances to planarize and flatten the uneven surfaces
Data Source
AI summary
The present invention relates to a method of supplying the polishing liquid by periodically interrupt the supply of the polishing liquid, thus avoid over-supply or wastage of the polishing liquid. Hence, the consumption of the polishing liquid can be decreased and the production cost can be lower.