Polishing Apparatus Microwave Temperature Measurement
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Solution Overview
Problem
Existing chemical mechanical polishing (CMP) technologies face challenges in accurately measuring the surface temperature of semiconductor substrates during polishing due to shielding by the polishing liquid, which hinders precise control of the polishing rate.
Innovation Solution
A polishing apparatus equipped with a microwave detection sensor embedded in the polishing table that generates microwave detection data to determine the surface temperature of the substrate, allowing for non-contact measurement through microwaves that can pass through the polishing liquid, and a controller to adjust the polishing pad temperature based on the detected data.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If an infrared radiation thermometer is used to measure substrate surface temperature, then non-contact measurement is achieved, but measurement accuracy deteriorates due to shielding by polishing liquid
Solution Approach 1:
The patent changes the detection wavelength parameter from infrared (which is shielded by polishing liquid) to microwave frequency (which can penetrate polishing liquid). This parameter change allows the measurement to occur through the polishing liquid medium, resolving the contradiction between non-contact measurement capability and measurement accuracy.
2Measurement precision
If a contact-type temperature sensor is used, then measurement accuracy is improved, but device complexity and risk of damage increase
Solution Approach 1:
The patent replaces the mechanical contact-type temperature sensor with a non-contact microwave detection system. This substitution eliminates the need for physical contact between the sensor and substrate, removing the complexity of protection mechanisms while maintaining measurement capability through electromagnetic wave interaction.
3Measurement precision
If microwave detection is used to measure through polishing liquid, then measurement accuracy is improved, but device complexity increases due to sensor embedding
Solution Approach 1:
The polishing table is designed with multi-functionality: it serves both as the polishing surface support structure and as the mounting platform for the microwave detection sensor. This integration allows the sensor to be positioned optimally for measurement while utilizing existing structural components, thereby reducing overall device complexity despite the addition of sensing capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate measurement of substrate surface temperature without interference from the polishing liquid, improving the precision of the polishing process and allowing for targeted temperature adjustments to optimize the polishing rate.
Implementation Method 1
a microwave detection sensor embedded in the polishing table and configured to generate microwave detection data by detecting microwaves
Implementation Method 2
due to a wavelength range of the infrared radiation, the infrared radiation may not penetrate the polishing liquid and may be shielded
Data Source
AI summary
A polishing apparatus capable of measuring a surface temperature of a substrate while suppressing shielding by a polishing liquid is disclosed. The polishing apparatus includes a microwave detection sensor configured to generate microwave detection data by detecting microwaves, and a controller configured to determine the surface temperature of the substrate based on the microwave detection data.